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ADC12138CIMSAX/NOPB

Texas Instruments

ADC12138CIMSAX/NOPB by Texas Instruments

ADC12138CIMSAX/NOPB by Texas Instruments is a 12-bit ADC with 8 analog input channels, operating at 3.3V/5V. It offers 0.0488% max linearity error and a conversion time of 8.8us, making it ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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VNN

France . 5,095 parts In-Stock

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Vyrian

USA . 3,990 parts In-Stock

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Digiode

USA . 3,166 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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One Stop Electronics

USA . 853 parts In-Stock

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$14.000

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853

$14.000

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Ampacity Inc.

Singapore . 1,175 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 381 parts In-Stock

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$17.850

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Corohmni

South Africa . 176 parts In-Stock

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$21.108

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Parana Technologies

USA . 895 parts In-Stock

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$24.031

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$24.690

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$24.031

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DigiPath Technology Company

USA . 754 parts In-Stock

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$26.461

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$24.344

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$26.461

$24.344

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ChromeModa Solutions

Germany . 4,786 parts In-Stock

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$27.001

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$22.141

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

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$27.001

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$25.651

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$24.301

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Component Stockers USA

USA . 690 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 5,512 parts In-Stock

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Futuretech Components

Singapore . 3,980 parts In-Stock

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Argo Parts USA

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Aranea Global

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Corphita

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Perfect Parts

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Overview

Experience superior quality and precision with the ADC12138CIMSAX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers analog-to-digital converters that excel in performance and reliability. With 8 analog input channels and a 12-bit resolution, this small outline package offers unmatched accuracy and efficiency for a wide range of industrial applications. Trust in Texas Instruments to provide cutting-edge technology that enhances your systems while maximizing value and functionality. Elevate your projects with the ADC12138CIMSAX/NOPB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the ADC, making it suitable for various environments.

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple signals to be processed simultaneously, increasing the versatility and efficiency of the ADC.

Surface Mount: YES

Surface mount capability enables easy and secure installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient and space-saving integration into electronic systems or devices.

No. of Bits: 12

12-bit resolution provides high accuracy and precision in converting analog signals to digital data, ensuring reliable performance.

Maximum Linearity Error (EL): 0.0488 %

Low linearity error ensures minimal distortion or deviation in the conversion process, resulting in accurate digital representation of analog signals.

Power Supplies (V): 3.3/5

Support for dual power supplies (3.3V/5V) offers flexibility in different system configurations and power requirements.

No. of Terminals: 28

Having 28 terminals allows for easy connectivity and integration with other components, enhancing the overall functionality of the ADC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style optimizes PCB layout and design, making it suitable for compact and space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance consistency even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40°C to 85°C) enables the ADC to function effectively in varying temperature environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting and connectivity options, facilitating seamless integration into diverse electronic systems.

Maximum Conversion Time: 8.8 us

Fast conversion time of 8.8 microseconds ensures quick processing of analog signals, minimizing latency and improving overall system efficiency.

Maximum Seated Height: 2 mm

Low seated height of 2mm saves space and enables compact designs in electronic assemblies or devices.

Width: 5.3 mm

Narrow width of 5.3mm allows for efficient placement on PCBs and reduces footprint, ideal for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature handling of 260°C for 30 seconds ensures reliable solder joint connections during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C enables robust soldering during manufacturing, ensuring secure and durable connections.

Length: 10.2 mm

Compact length of 10.2mm facilitates easy installation and integration into electronic assemblies with limited space availability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade classification signifies enhanced reliability and performance under harsh operating conditions commonly found in industrial settings.

Maximum Analog Input Voltage: 5.55 V

Support for a maximum analog input voltage of 5.55V accommodates a wide range of signal levels, making the ADC versatile and compatible with various sensors or sources.

Terminal Form: GULL WING

Gull wing terminal form allows for secure soldering and reliable electrical connections, ensuring stability and longevity in operation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC type offers high-speed and high-accuracy conversion capabilities, making it suitable for applications requiring precision and efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the ADC, enhancing overall system performance.

Output Bit Code: 2'S COMPLEMENT BINARY

Outputting data in 2's complement binary format allows for easy interpretation and processing of digital signals, ensuring compatibility with a wide range of systems and applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables precise and secure connection to PCBs, enhancing connectivity and reliability in electronic assemblies.

Minimum Analog Input Voltage: -0.05 V

Support for a minimum analog input voltage of -0.05V allows for capturing a wide range of signal levels, ensuring accurate conversion and data acquisition.

Output Format: SERIAL

Serial output format offers efficient data transmission and processing, simplifying connectivity and integration with other digital systems or devices.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality allows for accurate and stable signal acquisition during conversion, ensuring reliable and precise digital output.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate moisture sensitivity, making the ADC suitable for a variety of storage and operational environments with controlled humidity levels.

Technical Specifications

Analog-to-Digital Converters ADC12138CIMSAX/NOPB attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Hold Mode:

Sample

Maximum Conversion Time:

8.8 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

5.55 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC12138CIMSAX/NOPB Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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