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ADC11DV200EB/NOPB

Texas Instruments

ADC11DV200EB/NOPB by Texas Instruments

ADC11DV200EB/NOPB by Texas Instruments is a dual 11-bit Analog to Digital Converter (ADC) Evaluation Board with a sampling rate of 200MSPS. It features a data interface of Parallel and an input range of 1.5Vpp, consuming 450mW @ 200MSPS. This board is ideal for applications requiring high-speed and accurate analog-to-digital conversion in various electronic systems.

Median Price

$592.055

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2 parts In-Stock

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$89.560

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Farnell

UK . 1 parts In-Stock

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$467.690

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DigiKey

USA . 2 parts In-Stock

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$716.420

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$716.420

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Element14

Singapore . 1 parts In-Stock

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$1,005.920

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$1,005.920

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Distributors (In-Stock)

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Digiode

USA . 2,332 parts In-Stock

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$444.306

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Vyrian

USA . 7,293 parts In-Stock

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Native Components

USA . 805 parts In-Stock

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$10.752

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$10.752

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Northwest PG Solutions

USA . 1,554 parts In-Stock

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$11.827

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$10.645

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$397.540

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Semicontronic

India . 1 parts In-Stock

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$397.540

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$387.602

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$385.614

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Corphita

USA . 1,958 parts In-Stock

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$420.921

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Corohmni

South Africa . 53 parts In-Stock

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$467.690

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53

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$467.690

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ChromeModa Solutions

Germany . 6,474 parts In-Stock

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IDEA Electronic Components Group

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DigiPath Technology Company

USA . 360 parts In-Stock

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360

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Parana Technologies

USA . 315 parts In-Stock

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$1.325

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Discover the ADC11DV200EB/NOPB by Texas Instruments, a high-quality Analog to Digital Converter (ADC) Evaluation Board that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this board is perfect for a wide range of applications in the development and evaluation of electronic systems. The ADC11DV200EB/NOPB provides customers with value, benefits, and advantages, making it an essential tool for anyone looking to optimize their analog to digital conversion processes. Upgrade your projects today with the ADC11DV200EB/NOPB!

Feature Benefit Bullets

Other Names: ADC11DV200EBNOPB

Easy to identify and refer to in documentation or discussions

Number of A/D Converters: 2

Provides increased flexibility and accuracy in analog to digital conversion

Number of Bits: 11

Offers high resolution for precise digital representation of analog signals

Sampling Rate (Per Second): 200M

Fast and efficient sampling rate for capturing high-frequency signals

Data Interface: Parallel

Allows for high-speed data transfer and processing

Input Range: 1.5Vpp

Suitable for a wide range of input signal amplitudes

Power (Typ) @ Conditions: 450mW @ 200MSPS

Efficient power consumption for the specified sampling rate

Utilized IC / Part: ADC11DV200

Utilizes a specific analog to digital converter for optimized performance

Supplied Contents: Board(s)

Includes necessary components for immediate evaluation and testing

Base Product Number: ADC11D

Part of a series of products with similar features and functionality

Moisture Sensitivity Level (MSL): 1 (Unlimited)

No restrictions on exposure to moisture, ensuring reliability in various environments

Technical Specifications

Additional Parts ADC11DV200EB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

ADC11DV200EBNOPB

Category:

Development Boards, Kits, Programmers
Evaluation Boards Analog to Digital Converters (ADCs) Evaluation Boards

Number of A/D Converters:

2

Data Interface:

Parallel

Standard Package:

1

Supplied Contents:

Board(s)

Input Range:

1.5Vpp

Number of Bits:

11

Utilized IC / Part:

ADC11DV200

Package:

Box

Sampling Rate (Per Second):

200M

Power (Typ) @ Conditions:

450mW @ 200MSPS

Base Product Number:

ADC11D

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADC11DV200EB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

9030.90.6600

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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