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ADC10732CIWM

Texas Instruments

ADC10732CIWM by Texas Instruments

ADC10732CIWM by Texas Instruments is a 10-bit ADC with 0.1221% linearity error, 2 analog in channels, and 5us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,462 parts In-Stock

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Digiode

USA . 5,208 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,528 parts In-Stock

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3,528

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Anansix

USA . 2,708 parts In-Stock

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AZTECH Wire

Italy . 7,462 parts In-Stock

1+ parts

$3.310

100+ parts

$3.180

1k+ parts

$3.120

10k+ parts

$3.050

7,462

$3.310

$3.180

$3.120

$3.050

Parana Technologies

USA . 2,181 parts In-Stock

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$6.838

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$7.470

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$6.838

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$7.470

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DigiPath Technology Company

USA . 1,489 parts In-Stock

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$7.529

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$6.927

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1,489

$7.529

$6.927

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ChromeModa Solutions

Germany . 6,800 parts In-Stock

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$7.683

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$6.300

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$7.683

$6.300

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IDEA Electronic Components Group

UK . 997 parts In-Stock

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$7.683

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$6.915

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997

$7.683

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$6.915

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One Stop Electronics

USA . 618 parts In-Stock

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$12.000

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618

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Kepictronics

USA . 4,000 parts In-Stock

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Corphita

USA . 3,807 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,528 parts In-Stock

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Glotronic Ltd.

UK . 2,822 parts In-Stock

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Native Components

USA . 761 parts In-Stock

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Northwest PG Solutions

USA . 445 parts In-Stock

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Microchip USA

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Overview

Upgrade your analog-to-digital conversion with the Texas Instruments ADC10732CIWM. Designed with precision and reliability in mind, this high-quality converter offers a seamless transition from analog to digital signals. With its compact size and industrial-grade temperature range, this converter is perfect for a wide range of applications. Experience faster conversion times and improved accuracy with the ADC10732CIWM, providing value and benefits that will elevate your projects to the next level. Choose Texas Instruments for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability, making the product suitable for a variety of industrial applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in gathering data from multiple sources simultaneously.

Surface Mount: YES

Surface mount capability makes installation and integration of the product easier and more efficient.

No. of Bits: 10

With 10 bits of resolution, this product can provide accurate and precise digital conversions of analog signals.

Maximum Linearity Error (EL): 0.1221 %

With a low linearity error, the product ensures accurate conversion and minimal distortion of input signals.

No. of Terminals: 20

Having 20 terminals allows for easy connection and integration into existing systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is ideal for applications with limited real estate.

Maximum Operating Temperature: 85 °C

The wide operating temperature range makes the product suitable for use in various environments.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures the product's reliability in harsh conditions.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting the product to different systems.

Maximum Conversion Time: 5 us

Fast conversion time ensures real-time processing of analog signals, making the product suitable for dynamic applications.

Maximum Seated Height: 2.642 mm

Low seated height makes the product suitable for compact designs and applications with space constraints.

Width: 7.493 mm

Compact width allows for easy integration into existing systems and designs.

Length: 12.8015 mm

The product's length is optimized for various applications and allows for flexible placement within a system.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product's reliability in harsh environmental conditions.

Sample Rate: 0.0074 MHz

With a high sample rate, the product can capture and process analog signals accurately and efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during installation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC type offers high accuracy and speed in converting analog signals to digital, making the product ideal for precision applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes integration and compatibility with existing systems easier.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and communication within digital systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection and compatibility with various connectors and sockets.

Output Format: SERIAL

Serial output format enables easy data transmission and communication with other digital components or systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality ensures accurate sampling of analog signals, making the product suitable for applications requiring precise data acquisition.

Technical Specifications

Analog-to-Digital Converters ADC10732CIWM attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

10

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1221 %

Sample Rate:

7.4 kHz

Hold Mode:

Sample

Maximum Conversion Time:

5 µs

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.493 mm)

Length:

0.504 in (12.8015 mm)

Maximum Seated Height:

0.104 in (2.642 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Trade Compliance

ADC10732CIWM Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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