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ADC08DL502CIVV/NOPB

Texas Instruments

ADC08DL502CIVV/NOPB by Texas Instruments

ADC08DL502CIVV/NOPB by Texas Instruments is an 8-bit ADC with 2 analog input channels, operating at a sample rate of 500 MHz. It features a max linearity error of 0.3516%, suitable for applications requiring high-speed and accurate analog-to-digital conversion in compact designs. The package style is flatpack with low profile and fine pitch, making it ideal for space-constrained environments.

Median Price

$56.226

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 52,339 parts In-Stock

1+ parts

$57.982

100+ parts

$51.540

1k+ parts

$37.897

10k+ parts

-

52,339

$57.982

$51.540

$37.897

-

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$54.470

1k+ parts

$48.740

10k+ parts

$45.870

1

-

$54.470

$48.740

$45.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 772 parts In-Stock

1+ parts

$49.998

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$49.998

-

-

-

Vyrian

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

-

-

-

-

Chip Stock

USA . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

166

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 587 parts In-Stock

1+ parts

$0.853

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$0.853

-

-

-

Northwest PG Solutions

USA . 1,338 parts In-Stock

1+ parts

$0.939

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

$0.939

-

-

-

Parana Technologies

USA . 1,020 parts In-Stock

1+ parts

$5.923

100+ parts

$550.036

1k+ parts

$5.331

10k+ parts

-

1,020

$5.923

$550.036

$5.331

-

DigiPath Technology Company

USA . 7 parts In-Stock

1+ parts

$6.522

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$6.522

-

-

-

ChromeModa Solutions

Germany . 6,776 parts In-Stock

1+ parts

$6.655

100+ parts

$5.457

1k+ parts

-

10k+ parts

-

6,776

$6.655

$5.457

-

-

IDEA Electronic Components Group

UK . 1,916 parts In-Stock

1+ parts

$6.655

100+ parts

-

1k+ parts

$5.990

10k+ parts

-

1,916

$6.655

-

$5.990

-

AZTECH Wire

Italy . 1,156 parts In-Stock

1+ parts

$18.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$18.220

-

-

-

Corphita

USA . 1,908 parts In-Stock

1+ parts

$47.367

100+ parts

-

1k+ parts

-

10k+ parts

-

1,908

$47.367

-

-

-

Lixinc

USA . 9,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,373

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-

-

-

Overview

Experience unmatched precision and reliability with the ADC08DL502CIVV/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that cater to a wide range of applications. With its superior performance and cutting-edge technology, this product ensures accurate data conversion and seamless integration. Trust Texas Instruments to provide you with the value and benefits you need to take your projects to the next level. Upgrade to the ADC08DL502CIVV/NOPB today and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for housing the components.

No. of Analog In Channels: 2

Allows for multiple analog inputs to be converted to digital signals simultaneously.

Surface Mount: YES

Easily mountable on circuit boards for efficient integration.

No. of Bits: 8

Provides a good resolution for converting analog signals with precision.

Power Supplies (V): 1.9

Operates efficiently with low power supply voltage.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures without performance degradation.

Sample Rate: 500 MHz

High sampling rate enables quick and accurate analog-to-digital conversion.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Output Bit Code: OFFSET BINARY

Provides a standard output format for further processing of digital data.

Technical Specifications

Analog-to-Digital Converters ADC08DL502CIVV/NOPB attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3516 %

Sample Rate:

500 MHz

Hold Mode:

Sample

Maximum Conversion Time:

2 ns

Electrical Specifications

Power Supplies:

1.9 V

Minimum Analog Input Voltage:

-840 mV

Maximum Analog Input Voltage:

840 mV

Nominal Supply Voltage:

1.9 V

Maximum Supply Current:

650 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

144

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.787 in (20 mm)

Length:

0.787 in (20 mm)

Maximum Seated Height:

0.063 in (1.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

QFP144,.87SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G144

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC08DL502CIVV/NOPB Converters trade compliance attributes, and parameters.

ECCN

3A991.C.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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