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ADC0808MFKB

Texas Instruments

ADC0808MFKB by Texas Instruments

ADC0808MFKB by Texas Instruments is an 8-bit Analog-to-Digital Converter with 8 channels. Operating at 5V, it has a temperature range of -55 to 125°C. Ideal for military applications, this CMOS technology chip carrier supports binary output coding.

Median Price

$11.375

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 92 parts In-Stock

1+ parts

-

100+ parts

$9.100

1k+ parts

$8.140

10k+ parts

$7.660

92

-

$9.100

$8.140

$7.660

DigiKey

USA . 92 parts In-Stock

1+ parts

-

100+ parts

$11.980

1k+ parts

-

10k+ parts

-

92

-

$11.980

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Verical

USA . 92 parts In-Stock

1+ parts

-

100+ parts

$11.375

1k+ parts

$10.175

10k+ parts

$9.575

92

-

$11.375

$10.175

$9.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,261 parts In-Stock

1+ parts

$9.604

100+ parts

-

1k+ parts

-

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2,261

$9.604

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$21.142

100+ parts

-

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-

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550

$21.142

-

-

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Vyrian

USA . 6,402 parts In-Stock

1+ parts

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6,402

-

-

-

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DigiKey Marketplace

USA . 121 parts In-Stock

1+ parts

-

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121

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,810 parts In-Stock

1+ parts

$9.099

100+ parts

-

1k+ parts

-

10k+ parts

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4,810

$9.099

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-

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Parana Technologies

USA . 542 parts In-Stock

1+ parts

$13.213

100+ parts

-

1k+ parts

$13.719

10k+ parts

-

542

$13.213

-

$13.719

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DigiPath Technology Company

USA . 678 parts In-Stock

1+ parts

$14.549

100+ parts

$13.385

1k+ parts

-

10k+ parts

-

678

$14.549

$13.385

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ChromeModa Solutions

Germany . 1,225 parts In-Stock

1+ parts

$14.846

100+ parts

$12.174

1k+ parts

-

10k+ parts

-

1,225

$14.846

$12.174

-

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

1+ parts

$14.846

100+ parts

$14.104

1k+ parts

$13.361

10k+ parts

-

1,160

$14.846

$14.104

$13.361

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Northwest PG Solutions

USA . 182 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.665

10k+ parts

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182

-

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$4.665

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Native Components

USA . 86 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.617

10k+ parts

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86

-

-

$4.617

-

Overview

Enhance your analog-to-digital conversion experience with the ADC0808MFKB by Texas Instruments. Crafted with precision and quality, this versatile chip carrier package offers 8 channels for seamless conversions in military-grade applications. With a nominal supply voltage of 5V and a temperature range from -55°C to 125°C, this CMOS technology converter ensures reliability and accuracy in every use. Elevate your projects with the ADC0808MFKB and unlock a world of possibilities in data acquisition and signal processing.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides durability and stability for the converter, making it suitable for harsh environments.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile input options, making this converter suitable for multi-channel applications.

Surface Mount: YES

Surface mount capability makes installation and board assembly easier and more efficient.

Screening Level: 38535Q/M;38534H;883B

The screening level ensures high reliability and performance standards, making it suitable for military and aerospace applications.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the PCB.

No. of Bits: 8

8-bit resolution allows for adequate precision in converting analog signals to digital data.

Power Supplies (V): 5

Operating at 5V provides a standard power supply requirement, making it compatible with most systems.

No. of Terminals: 28

Having 28 terminals allows for flexible connectivity options and ease of integration.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers efficient heat dissipation and protection for the converter.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in challenging thermal conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Position: QUAD

Quad terminal position enhances stability and ease of connection.

Temperature Grade: MILITARY

Military-grade temperature rating ensures durability and reliability in critical applications.

Maximum Analog Input Voltage: 0 V

Having a maximum analog input voltage of 0V protects the converter from potential overloads.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Terminal Form: NO LEAD

No lead terminal form enhances electrical conductivity and reliability.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter ensures accurate conversion of digital signals to analog output.

Nominal Supply Voltage: 5 V

Operating at 5V nominal supply voltage makes it compatible with a wide range of systems.

Output Bit Code: BINARY

Binary output bit code simplifies data processing and compatibility with digital systems.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm allows for easy soldering and connection on the PCB.

Technical Specifications

Analog-to-Digital Converters ADC0808MFKB attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

Converter Type:

No. of Analog In Channels:

8

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Electrical Specifications

Power Supplies:

5 V

Maximum Analog Input Voltage:

0 mV

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Ceramic

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N28

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

ADC0808MFKB Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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