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AC5960N

Texas Instruments

AC5960N by Texas Instruments

The Texas Instruments AC5960N Clock IC features 24 terminals in a rectangular package with plastic/epoxy material. Operating temperature range is 0-80°C, suitable for commercial extended applications. Utilizes bipolar technology with through-hole terminals at 2.54mm pitch, ideal for various clock circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,815 parts In-Stock

1+ parts

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3,815

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Digiode

USA . 1,552 parts In-Stock

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1,552

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 613 parts In-Stock

1+ parts

$2.067

100+ parts

-

1k+ parts

$2.587

10k+ parts

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613

$2.067

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$2.587

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DigiPath Technology Company

USA . 1,259 parts In-Stock

1+ parts

$2.276

100+ parts

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1,259

$2.276

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ChromeModa Solutions

Germany . 4,334 parts In-Stock

1+ parts

$2.322

100+ parts

$1.904

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4,334

$2.322

$1.904

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IDEA Electronic Components Group

UK . 1,740 parts In-Stock

1+ parts

$2.322

100+ parts

-

1k+ parts

$2.090

10k+ parts

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1,740

$2.322

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$2.090

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One Stop Electronics

USA . 1,093 parts In-Stock

1+ parts

$14.800

100+ parts

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1,093

$14.800

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$17.482

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223

$17.482

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Northwest PG Solutions

USA . 1,739 parts In-Stock

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1,739

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Corphita

USA . 1,289 parts In-Stock

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1,289

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Native Components

USA . 798 parts In-Stock

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798

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Overview

Unleash the power of precision timing with the AC5960N by Texas Instruments. Crafted with excellence by a trusted manufacturer, this clock IC promises top-notch quality and reliability. Ideal for a wide range of applications in various industries, this product offers unbeatable value and benefits to customers seeking superior performance and efficiency. Upgrade your electronic devices with the AC5960N and experience the difference of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various types of circuit boards or systems.

No. of Terminals: 24

The 24 terminals provide ample connectivity options, allowing for versatile use in different applications.

Package Style (Meter): IN-LINE

The in-line package style makes installation and placement of the clock ICs neat and organized, saving space on the PCB.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80°C, this clock ICs can function reliably even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the clock ICs can operate effectively in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position enhances connectivity and stability, allowing for secure connections without risk of disconnection.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures that the clock ICs can perform reliably in industrial or commercial applications, even in challenging temperature conditions.

Technology: BIPOLAR

The bipolar technology used in the clock ICs ensures high performance and efficiency, making them a competitive choice for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easier to solder the clock ICs onto the PCB, providing a secure and reliable connection.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy alignment and soldering on standard PCBs, simplifying the manufacturing and assembly process.

Technical Specifications

Clock ICs AC5960N attributes and parameters. Explore more Clock ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Clock ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

AC5960N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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