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7802401SX

Texas Instruments

7802401SX by Texas Instruments

The Texas Instruments 7802401SX is an 8-bit digital shift register with a propagation delay of 39ns. Operating b/w -55 to 125°C, it features a true output polarity and positive edge trigger type. Ideal for military-grade applications requiring bidirectional count direction and a max supply voltage of 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,458 parts In-Stock

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7,458

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Digiode

USA . 343 parts In-Stock

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343

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Resion

USA . 5 parts In-Stock

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5

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Native Components

USA . 655 parts In-Stock

1+ parts

$0.060

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-

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$0.058

655

$0.060

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$0.058

Parana Technologies

USA . 44 parts In-Stock

1+ parts

$9.557

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$10.154

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44

$9.557

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$10.154

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DigiPath Technology Company

USA . 2,004 parts In-Stock

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$10.523

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2,004

$10.523

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ChromeModa Solutions

Germany . 2,385 parts In-Stock

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$10.738

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$8.805

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2,385

$10.738

$8.805

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

1+ parts

$10.738

100+ parts

$10.201

1k+ parts

$9.664

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1,141

$10.738

$10.201

$9.664

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AZTECH Wire

Italy . 474 parts In-Stock

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$12.067

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474

$12.067

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One Stop Electronics

USA . 924 parts In-Stock

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$65.000

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924

$65.000

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Corphita

USA . 2,400 parts In-Stock

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Northwest PG Solutions

USA . 328 parts In-Stock

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Overview

Elevate your digital shift register game with the 7802401SX by Texas Instruments. Crafted from high-quality CERAMIC and GLASS-SEALED materials, this rectangular package offers 8 bits of precision engineering for your applications. With a 3-STATE output and a quick 39 ns propagation delay, this MILITARY-grade device ensures optimal performance in extreme conditions. Trust Texas Instruments to deliver cutting-edge technology with reliability and efficiency. Unlock new possibilities and streamline your projects with the 7802401SX.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the digital shift register, making it suitable for a variety of applications.

No. of Bits: 8

With 8 bits, this digital shift register can handle moderate amounts of data transfer efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Propagation Delay (tpd): 39 ns

The low propagation delay of 39ns allows for high-speed data processing and reduces latency in signal transmission.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in hot environments, making it suitable for industrial applications.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices and provides reliable logic levels for data processing.

Technical Specifications

Digital Shift Registers 7802401SX attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

BIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-GDFP-F20

Length:

13.09 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

39 ns

Qualification:

Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

20 MHz

Trade Compliance

7802401SX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-217-5381, 5962012175381

NIIN

012175381

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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