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74FCT2574CTSOCTE4

Texas Instruments

74FCT2574CTSOCTE4 by Texas Instruments

74FCT2574CTSOCTE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.2 ns at 5V, suitable for industrial applications. It features a max I (ol) of 12A, operates b/w -40 to 85°C, and offers a true output polarity in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,146 parts In-Stock

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4,146

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Digiode

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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Andel Nordic

Denmark . 202 parts In-Stock

1+ parts

$7.389

100+ parts

-

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$7.093

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$7.093

202

$7.389

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$7.093

$7.093

AZTECH Wire

Italy . 635 parts In-Stock

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$9.591

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635

$9.591

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Parana Technologies

USA . 2,213 parts In-Stock

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$24.485

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$25.151

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2,213

$24.485

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$25.151

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DigiPath Technology Company

USA . 2,104 parts In-Stock

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$26.961

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$24.804

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2,104

$26.961

$24.804

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ChromeModa Solutions

Germany . 3,394 parts In-Stock

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$27.511

100+ parts

$22.559

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3,394

$27.511

$22.559

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IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$27.511

100+ parts

$26.135

1k+ parts

$24.760

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1,428

$27.511

$26.135

$24.760

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One Stop Electronics

USA . 1,493 parts In-Stock

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$49.000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,533 parts In-Stock

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Corphita

USA . 1,114 parts In-Stock

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Northwest PG Solutions

USA . 956 parts In-Stock

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Microchip USA

USA . 394 parts In-Stock

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Native Components

USA . 176 parts In-Stock

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Overview

Unlock seamless data transmission with the 74FCT2574CTSOCTE4 by Texas Instruments. Renowned for their top-notch quality, Texas Instruments delivers cutting-edge Bus Driver & Transceivers that cater to a wide range of applications. Designed to provide reliable and efficient performance, this product ensures fast propagation delay and low power consumption. Perfect for industrial use, the 74FCT2574CTSOCTE4 guarantees high-speed data transfers with its true output polarity and positive edge trigger type. Trust Texas Instruments for unmatched value and superior technology that elevates your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures fast and efficient signal transmission, making the product ideal for high-speed data communication applications.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the PCB, making it a convenient option for compact designs.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit layouts and facilitates efficient board utilization.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

Optimized load capacitance value ensures stability and reliability in data transmission, reducing the risk of signal distortion.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable performance and consistent signal integrity across different operating conditions.

No. of Terminals: 20

Having 20 terminals enables the bus driver & transceivers to accommodate multiple connections and interface with various components in a system.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers space-saving benefits and facilitates efficient PCB layout design, making it suitable for compact electronic devices.

Maximum I (ol): 12 Amp

High maximum output current capability of 12A allows the bus driver & transceivers to drive heavy loads without overheating or performance degradation.

Propagation Delay (tpd): 5.2 ns

Low propagation delay of 5.2ns ensures minimal signal delay and fast data transmission, making the product suitable for time-critical applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range up to 85°C ensures reliability and stability in harsh environmental conditions, expanding the product's application versatility.

Output Characteristics: 3-STATE

3-state output characteristics allow the bus driver & transceivers to tri-state the output, providing flexibility in managing signal flow and bus contention.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing control and synchronization, making the product suitable for applications requiring accurate signal triggering.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments, making the product suitable for outdoor or industrial applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and facilitates easy connections, making the product versatile for various system configurations.

No. of Ports: 2

Having 2 ports allows the bus driver & transceivers to interface with multiple devices simultaneously, enhancing connectivity and communication capabilities.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65mm enables the product to fit in tight spaces and slim designs, optimizing board space utilization.

Width: 7.5 mm

Compact width of 7.5mm ensures compatibility with standard PCB layouts and promotes efficient circuit integration.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and simplifies signal interpretation, enhancing the product's usability in data transmission.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage requirement of 4.75V enables the product to operate efficiently with low-power sources, increasing energy efficiency.

Length: 12.8 mm

Optimal length of 12.8mm provides a balanced form factor for the bus driver & transceivers, allowing for easy integration into different electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments, making the product suitable for industrial automation and control systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability in data transmission.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections to the PCB, reducing the risk of signal loss or disconnection during operation.

Packing Method: TR

TR packing method offers convenient assembly and inventory management, simplifying the production process and ensuring product quality.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm facilitates easy soldering and PCB assembly, enhancing the product's reliability and ease of installation.

Maximum Supply Voltage (Vsup): 5.25 V

High maximum supply voltage of 5.25V ensures the product's compatibility with a wide range of power sources, providing flexibility in system integration.

Technical Specifications

Bus Driver & Transceivers 74FCT2574CTSOCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74FCT2574CTSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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