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74AVC16722DGGRE4

Texas Instruments

74AVC16722DGGRE4 by Texas Instruments

74AVC16722DGGRE4 by Texas Instruments is a 22-bit bus driver with a supply voltage of 1.5V, operating at temperatures from -40 to 85°C. It features a propagation delay of 6.3ns, output polarity TRUE, and supports load capacitance up to 30pF. Ideal for industrial applications requiring reliable signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,696 parts In-Stock

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4,696

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Digiode

USA . 2,617 parts In-Stock

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2,617

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 521 parts In-Stock

1+ parts

$0.450

100+ parts

-

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$0.432

521

$0.450

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$0.432

Northwest PG Solutions

USA . 781 parts In-Stock

1+ parts

$0.495

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-

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$0.436

781

$0.495

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$0.436

Andel Nordic

Denmark . 452 parts In-Stock

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$3.928

100+ parts

-

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$3.771

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$3.771

452

$3.928

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$3.771

$3.771

Parana Technologies

USA . 1,963 parts In-Stock

1+ parts

$8.109

100+ parts

-

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$8.700

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1,963

$8.109

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$8.700

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ChromeModa Solutions

Germany . 2,850 parts In-Stock

1+ parts

$9.111

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$7.471

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2,850

$9.111

$7.471

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IDEA Electronic Components Group

UK . 241 parts In-Stock

1+ parts

$9.111

100+ parts

$8.655

1k+ parts

$8.200

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241

$9.111

$8.655

$8.200

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AZTECH Wire

Italy . 214 parts In-Stock

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$14.253

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214

$14.253

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One Stop Electronics

USA . 1,492 parts In-Stock

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$15.000

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1,492

$15.000

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Microchip USA

USA . 2,204 parts In-Stock

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2,204

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DigiPath Technology Company

USA . 1,889 parts In-Stock

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$8.214

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$8.214

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Corphita

USA . 1,296 parts In-Stock

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Overview

Discover the cutting-edge 74AVC16722DGGRE4 by Texas Instruments, a top-tier Bus Driver & Transceiver that guarantees unmatched quality and reliability. Designed with precision and expertise, this product caters to a wide range of applications with its advanced features. From its high performance output characteristics to its efficient power supply, this gem offers exceptional value and benefits to customers looking for seamless connectivity solutions. Elevate your projects with the Texas Instruments advantage and experience innovation like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver, ensuring a long lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, making installation and assembly convenient.

No. of Bits: 22

Offers a high level of accuracy and precision in data transmission and reception.

Nominal Supply Voltage / Vsup (V): 1.5

Operates efficiently at a low voltage, conserving energy and reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying heat levels.

Propagation Delay (tpd): 6.3 ns

Provides fast response times for signal transmission, ensuring quick and reliable communication.

Technical Specifications

Bus Driver & Transceivers 74AVC16722DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

UNIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

22

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay (tpd):

6.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74AVC16722DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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