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5962R0722701VZA

Texas Instruments

5962R0722701VZA by Texas Instruments

The Texas Instruments 5962R0722701VZA is a 12-bit ADC with 8 analog input channels. It has a small outline package style and operates at temperatures ranging from -55 to 125 °C. This converter type is suitable for military applications due to its MIL-PRF-38535 Class V screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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VNN

France . 6,154 parts In-Stock

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Vyrian

USA . 4,448 parts In-Stock

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Digiode

USA . 2,364 parts In-Stock

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Anansix

USA . 771 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Component Sense

UK . 32 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

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$12.787

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$12.787

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Parana Technologies

USA . 396 parts In-Stock

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$14.713

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$15.153

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DigiPath Technology Company

USA . 1,277 parts In-Stock

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$16.201

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$14.905

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ChromeModa Solutions

Germany . 3,401 parts In-Stock

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$16.532

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$13.556

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$16.532

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IDEA Electronic Components Group

UK . 2,319 parts In-Stock

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$16.532

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$15.705

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$14.879

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Semicontronic

India . 1,363 parts In-Stock

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$18.000

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$17.550

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$17.460

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Corohmni

South Africa . 688 parts In-Stock

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$22.253

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One Stop Electronics

USA . 256 parts In-Stock

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$25.000

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Ampacity Inc.

Singapore . 678 parts In-Stock

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Lixinc

USA . 9,897 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,754 parts In-Stock

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Corphita

USA . 2,372 parts In-Stock

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Continental Prestige Electronics

USA . 1,384 parts In-Stock

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Microchip USA

USA . 1,108 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Perfect Parts

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Overview

Upgrade your analog-to-digital conversion with the 5962R0722701VZA by Texas Instruments. As a trusted manufacturer, Texas Instruments ensures top-quality products that meet the highest industry standards. This versatile ADC offers 8 analog input channels, a small outline package style, and a fast sample rate of 1 MHz. Designed for military-grade applications, it can withstand extreme temperatures and radiation exposure up to 100k Rad(Si). With its high precision and low linearity error, this ADC delivers accurate and reliable data conversion results. Experience the value and benefits of Texas Instruments' cutting-edge technology with the 5962R0722701VZA.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent protection and reliability for the internal components of the analog-to-digital converter, ensuring long-term performance.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatility in applications where multiple input signals need to be converted to digital format simultaneously.

Surface Mount: YES

Being surface mountable makes installation and integration of the ADC easier and more efficient in modern electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the ADC can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Maximum Analog Input Voltage: 5.25 V

The high maximum analog input voltage allows for the conversion of a wide range of input signals without risking damage to the ADC.

Technical Specifications

Analog-to-Digital Converters 5962R0722701VZA attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.03417 %

Sample Rate:

1 MHz

Hold Mode:

Track

Maximum Conversion Time:

812.5 ns

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

3 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Total Ionizing Dose:

100k Rad(Si)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.25 in (6.35 mm)

Maximum Seated Height:

0.092 in (2.33 mm)

Packaging

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-CDSO-G16

Qualified:

Yes

JESD-609 Code:

e0

Screening Level:

MIL-PRF-38535 Class V

Trade Compliance

5962R0722701VZA Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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