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5962-0722501VSC

Texas Instruments

5962-0722501VSC by Texas Instruments

Texas Instruments' 5962-0722501VSC is a CMOS technology-based LDO regulator with dual outputs. It offers fixed output voltages of 3.3V and 2.5V, with max currents of 1A and 2A respectively. Ideal for applications requiring precise voltage regulation in harsh environments due to MIL-PRF-38535 Class V screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,451 parts In-Stock

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Digiode

USA . 3,637 parts In-Stock

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3,637

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Distributors (Availability)

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AZTECH Wire

Italy . 611 parts In-Stock

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$5.128

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611

$5.128

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Parana Technologies

USA . 1,685 parts In-Stock

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$5.637

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$6.434

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1,685

$5.637

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$6.434

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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$6.207

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$5.711

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1,051

$6.207

$5.711

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ChromeModa Solutions

Germany . 6,485 parts In-Stock

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$6.334

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$5.194

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$6.334

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IDEA Electronic Components Group

UK . 999 parts In-Stock

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$6.334

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$5.701

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999

$6.334

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Native Components

USA . 897 parts In-Stock

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$7.280

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897

$7.280

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Semicontronic

India . 958 parts In-Stock

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$12.500

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$12.188

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$12.125

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958

$12.500

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One Stop Electronics

USA . 523 parts In-Stock

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$17.500

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Corphita

USA . 3,844 parts In-Stock

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Northwest PG Solutions

USA . 284 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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Overview

Elevate your power management system with the 5962-0722501VSC by Texas Instruments. Crafted with precision and reliability, this fixed regulator offers multiple positive outputs in a sleek ceramic, glass-sealed package. Ideal for a range of applications, from aerospace to industrial settings, this regulator ensures stable voltage levels for optimal performance. Experience the quality and value that Texas Instruments brings to every product, and elevate your projects with the 5962-0722501VSC today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent thermal resistance and reliability, making it suitable for harsh operating conditions.

Maximum Dropout Voltage-1: 1.4 V

Low dropout voltage ensures efficient power conversion, reducing power dissipation in the regulator.

Operating Temperature (TJ-Max): 125 °C

Allows the regulator to operate in high-temperature environments without compromising performance.

Minimum Output Voltage-1: 3.234 V

Offers a stable output voltage, ensuring consistent performance of connected components.

Nominal Output Voltage-1: 3.3 V

Provides a common and widely used output voltage, suitable for a variety of applications.

Maximum Output Current-1: 1 A

Capable of delivering a high output current, making it suitable for powering multiple components or higher power devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO 5962-0722501VSC attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.4 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

3.766 V

JESD-30 Code:

R-GDFP-F20

Maximum Line Regulation:

.00625 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

20

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Current-2:

2 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Maximum Output Voltage-2:

2.55 V

Minimum Output Voltage-2:

2.45 V

Nominal Output Voltage-2:

2.5 V

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Trade Compliance

5962-0722501VSC Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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