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5962-01-424-8971

Texas Instruments

5962-01-424-8971 by Texas Instruments

Texas Instruments' 5962-01-424-8971 is an 8-bit D/A converter with 0.5 us settling time, 0.2% linearity error, and operates on 5/15V supplies. Ideal for military applications, it features a ceramic package, quad terminal position, and CMOS technology for reliable performance in extreme temperatures.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,207 parts In-Stock

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7,207

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Digiode

USA . 3,390 parts In-Stock

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3,390

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Distributors (Availability)

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One Stop Electronics

USA . 1,181 parts In-Stock

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$2.000

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1,181

$2.000

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AZTECH Wire

Italy . 816 parts In-Stock

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$7.740

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816

$7.740

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Parana Technologies

USA . 1,797 parts In-Stock

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$8.811

100+ parts

$818.235

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$7.930

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1,797

$8.811

$818.235

$7.930

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Native Components

USA . 14 parts In-Stock

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$9.500

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14

$9.500

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DigiPath Technology Company

USA . 932 parts In-Stock

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$9.702

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932

$9.702

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ChromeModa Solutions

Germany . 5,738 parts In-Stock

1+ parts

$9.900

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$8.118

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5,738

$9.900

$8.118

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IDEA Electronic Components Group

UK . 1,945 parts In-Stock

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$9.900

100+ parts

$9.405

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$8.910

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1,945

$9.900

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$8.910

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Northwest PG Solutions

USA . 2,050 parts In-Stock

1+ parts

$10.450

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$9.405

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2,050

$10.450

$9.405

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Corphita

USA . 2,737 parts In-Stock

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2,737

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Overview

Unlock unmatched precision and reliability with the 5962-01-424-8971 by Texas Instruments. Crafted with cutting-edge technology, this D/A converter guarantees unparalleled performance in a variety of applications. From industrial automation to aerospace, its versatility knows no bounds. Experience seamless integration, exceptional linearity, and rapid settling time with this military-grade gem. Elevate your projects with Texas Instruments - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides durability and high temperature resistance, ensuring the product can withstand harsh environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: 38535Q/M;38534H;883B

Meets stringent military standards for reliability and performance, making it suitable for critical applications.

No. of Bits: 8

Offers sufficient resolution for accurate analog-to-digital conversion, making it suitable for a variety of precision measurement applications.

Maximum Settling Time: 0.5 us

Ensures fast response and accurate output, making the converter ideal for real-time applications.

Maximum Linearity Error (EL): 0.2 %

Maintains high accuracy and consistency in converting signals, ensuring reliable performance in demanding scenarios.

Power Supplies (V): 5/15

Offers flexibility in power requirements, allowing the product to be used in a wide range of voltage environments.

No. of Terminals: 20

Provides multiple connectivity options for ease of integration into existing systems.

Package Style (Meter): CHIP CARRIER

Compact and efficient packaging design that optimizes space on the PCB, ideal for applications with limited board space.

Maximum Operating Temperature: 125 °C

Operates reliably in high-temperature environments, suitable for industrial and military applications.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, making it suitable for outdoor or aerospace applications.

Temperature Grade: MILITARY

Meets strict military standards for reliability and performance, ensuring consistent operation in challenging conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the overall efficiency of the converter.

Terminal Form: NO LEAD

Lead-free terminal construction for compliance with environmental regulations and improved soldering reliability.

Maximum Supply Current: 2 mA

Low power consumption for energy efficiency, suitable for battery-powered or portable devices.

Converter Type: D/A CONVERTER

Digital-to-analog converter function for converting digital signals to analog voltages, essential for various signal processing applications.

Terminal Pitch: 1.27 mm

Optimal spacing between terminals for easy soldering and secure connections, facilitating smooth integration into circuits.

Input Bit Code: BINARY, OFFSET BINARY

Supports multiple input bit codes for versatile signal processing capabilities, enhancing the product's compatibility with different systems.

Technical Specifications

Other Function Converters 5962-01-424-8971 attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

8

No. of Functions:

1

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.2 %

Maximum Settling Time:

500 ns

Electrical Specifications

Maximum Supply Current:

2 mA

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Ceramic

Package Code:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-XQCC-N20

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

5962-01-424-8971 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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