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430BOOST-C55AUDIO1

Texas Instruments

430BOOST-C55AUDIO1 by Texas Instruments

430BOOST-C55AUDIO1 by Texas Instruments is a reference design for MP3 player applications. It features the MSP430G2553 IC, USB interface, and LaunchPad™ series compatibility. This evaluation board comes with necessary accessories in bulk packaging for embedded development projects.

Median Price

$9.890

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Farnell

UK . 5 parts In-Stock

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$9.890

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TME

Poland . 1 parts In-Stock

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$12.300

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Vyrian

USA . 7,353 parts In-Stock

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Digiode

USA . 2,885 parts In-Stock

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Native Components

USA . 808 parts In-Stock

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$0.587

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Northwest PG Solutions

USA . 1,662 parts In-Stock

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$0.646

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AZTECH Wire

Italy . 796 parts In-Stock

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$10.923

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Ampacity Inc.

Singapore . 438 parts In-Stock

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$23.100

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One Stop Electronics

USA . 504 parts In-Stock

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$43.100

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Semicontronic

India . 858 parts In-Stock

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$115.100

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$112.222

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$111.647

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ChromeModa Solutions

Germany . 6,509 parts In-Stock

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IDEA Electronic Components Group

UK . 912 parts In-Stock

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DigiPath Technology Company

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Corohmni

South Africa . 335 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 195 parts In-Stock

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$0.562

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Corphita

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Overview

Enhance your audio projects with the Texas Instruments 430BOOST-C55AUDIO1! This high-quality development board, part of the C5000™ series, offers an embedded MP3 player function powered by the MSP430G2553. Perfect for creating cutting-edge audio applications, this board comes with all necessary accessories and a USB interface for easy integration. Elevate your projects with the reliability and precision that Texas Instruments is known for, and experience the exceptional value and performance that the 430BOOST-C55AUDIO1 brings to your designs.

Feature Benefit Bullets

Other Names: 430BOOSTC55AUDIO1, 296-30374

Clearly identifies the product for easy reference and ordering.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Versatile product that can be used for development, evaluation, and programming purposes.

Series: C5000™, LaunchPad™, MSP430™

Part of well-known and respected series known for quality and innovation.

Package: Bulk

Comes in bulk packaging, ideal for manufacturers or large-scale projects.

Type: Reference Design

Can be used as a reference for designing similar MP3 player projects.

Function: MP3 Player

Specifically designed for MP3 player functionality, ensuring optimized performance.

Embedded: Yes

Embedded design for compact and integrated system.

Utilized IC / Part: MSP430G2553

Uses reliable and efficient MSP430G2553 IC for high-quality performance.

Supplied Contents: Board(s), Cable(s), Accessories

Comes with everything needed to start using the product immediately.

Secondary Attributes: USB Interface

Includes USB interface for easy and fast connectivity.

Base Product Number: 430BOOST

Part of the 430BOOST product line known for reliability and functionality.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for use in a variety of environments with no sensitivity to moisture.

Technical Specifications

Additional Parts 430BOOST-C55AUDIO1 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

430BOOSTC55AUDIO1
296-30374

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Series:

C5000™, LaunchPad™, MSP430™

Function:

MP3 Player

Type:

Reference Design

Supplied Contents:

Board(s), Cable(s), Accessories

Secondary Attributes:

USB Interface

Utilized IC / Part:

MSP430G2553

Package:

Bulk

Embedded:

Yes

Base Product Number:

430BOOST

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

430BOOST-C55AUDIO1 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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