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3652JG

Texas Instruments

3652JG by Texas Instruments

3652JG by Texas Instruments is an Isolation Amplifier with 32 terminals, Vsup of +-8/+-18V, and 2000V common mode voltage. It has a metal rectangular package suitable for microelectronic assembly applications at temperatures ranging from 0 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,652 parts In-Stock

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3,652

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Digiode

USA . 2,713 parts In-Stock

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2,713

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Electronics Depot

USA . 8 parts In-Stock

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8

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Extreme Components

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 525 parts In-Stock

1+ parts

$1.280

100+ parts

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$2.040

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525

$1.280

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$2.040

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DigiPath Technology Company

USA . 489 parts In-Stock

1+ parts

$1.409

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489

$1.409

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ChromeModa Solutions

Germany . 6,229 parts In-Stock

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$1.438

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$1.179

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6,229

$1.438

$1.179

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IDEA Electronic Components Group

UK . 106 parts In-Stock

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$1.438

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$1.294

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106

$1.438

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$1.294

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One Stop Electronics

USA . 1,479 parts In-Stock

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$9.410

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1,479

$9.410

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AZTECH Wire

Italy . 262 parts In-Stock

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$19.467

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262

$19.467

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Corphita

USA . 2,881 parts In-Stock

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Northwest PG Solutions

USA . 1,655 parts In-Stock

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$4.008

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1,655

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$4.008

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Native Components

USA . 857 parts In-Stock

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$3.967

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857

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$3.967

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RTC Component Inc.

USA . 2 parts In-Stock

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Overview

Unlock the power of precision with the 3652JG Isolation Amplifier by Texas Instruments. Crafted with quality materials and top-notch manufacturing, this device offers unmatched performance and reliability in a wide range of applications. From industrial automation to medical equipment, this isolation amplifier provides precise measurements and ensures safe operation in high voltage environments. Experience peace of mind knowing that your systems are protected with the 3652JG, delivering value, benefits, and advantages that set it apart from the competition. Elevate your projects with Texas Instruments' trusted technology.

Feature Benefit Bullets

Package Body Material: METAL

The metal body provides durability and protection, making it suitable for rugged environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into electronic systems and circuit boards.

Nominal Supply Voltage / Vsup (V): 15

The 15V supply voltage allows for stable and reliable operation of the isolation amplifier.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this isolation amplifier can withstand high temperatures without compromising performance.

Minimum Isolation Voltage: 2000 V

The high isolation voltage of 2000V ensures safe operation and protects sensitive components from damage.

Technical Specifications

Isolation Amplifiers 3652JG attributes and parameters. Explore more Isolation Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±8/±18 V

Total Functions:

1

Sub-Category:

Isolation Amplifiers

Performance Specifications

Maximum Common Mode Voltage:

2 KV

Operational Characteristics

Nominal Supply Voltage:

15 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Isolation Voltage:

2 KV

Physical Characteristics

Total Terminals:

32

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Metal

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-MDMA-P32

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

Microelectronic Assembly

Package Equivalence Code:

DIP32,.9

Trade Compliance

3652JG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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