Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK TUBE;
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Heat Shrinks VERSAFIT-3/16-6-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
International Semiconductor
Crimson Semiconductor
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
LM358DT
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
202K163-25-20/225-0
TE Connectivity
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER;
TMS-SCE-1/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
202K142-25/86-0
TE Connectivity's 202K142-25/86-0 is a dual wall heat shrink with an elastomer jacket material. It has a min cable entry of 7.1 inch and can withstand temperatures ranging from -75 to 150 °C. This heat shrink is commonly used in applications requiring insulation and protection for cables up to 0 AWG size, with a max cable entry of 17 inch.
SO63-2-9036-18
TE Connectivity SO63-2-9036-18 heat shrink features single wall construction with polyvinylidene fluoride jacket. Solder terminal type, 150°C max operating temp, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for electrical insulation in various applications.
M23053/5-205-C
Defense Logistics Agency
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
301A022-25-0
TE Connectivity 301A022-25-0 is a SINGLE WALL heat shrink with ELASTOMER jacket. It has a temp range of -75 to 150°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
S03-03-R-100CS244
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
M23053/5-104-9
Grayline
HEAT SHRINK TUBE; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO;
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
15179
Pro-power
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
ES2000-NO.3-B8-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 130 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
D-436-83
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
RNF-100-3/32-X-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
TMS-SCE-1/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
VERSAFIT-1-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
CWT-5-S
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
S02-03-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 20 AWG; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 20;
RNF-100-1-WH-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
TMS-SCE-1K-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
M23053/5-106-9
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
VERSAFIT-1/8-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Additional Features: REFERENCE STANDARD: CSA; UL;
VERSAFIT-3/16-0-STK
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Additional Features: REFERENCE STANDARD: CSA; UL; Construction: SINGLE WALL;
VERSAFIT-3/8-0-STK
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
VERSAFIT-1-1/4-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
VERSAFIT-3/64-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
VERSAFIT-3/64-0-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Additional Features: REFERENCE STANDARD: CSA; UL;
VERSAFIT-1-1/2-0-SP
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Construction: SINGLE WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
VERSAFIT-3/16-0-SP
VERSAFIT-1/16-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
VERSAFIT-1-0-SP.
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
VERSAFIT-3/16-9-SP
VERSAFIT-3/16-KT2-REFILL
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
VERSAFIT-3/8-KT2-REFILL
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Additional Features: REFERENCE STANDARD: CSA; UL;
VERSAFIT-MINI-SPL-3/64-BK
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
VERSAFIT-3/8-0-FSP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
VERSAFIT-3/4-2-FSP
VERSAFIT-3/64-2-SP
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
VERSAFIT-3/64-2-SP-SM
VERSAFIT-3/16-7-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
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