Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
Median Price
$1.032
Lifecycle Status
Suppliers In-Stock
39
In-Stock Inventory
1k+
WireMasters
1+ parts
$0.591
100+ parts
$0.563
1k+ parts
$0.484
10k+ parts
$0.457
Arrow
$1.137
$0.790
$0.572
-
Mouser Electronics
$1.780
$1.120
$0.589
TE Connectivity
$2.260
$2.010
$1.880
Chip1Stop
$3.950
Adafruit Industries
$10.300
$9.785
Farnell
$177.129
$163.692
Element14
$230.698
$215.006
Newark
$280.140
$214.390
TTI
$0.770
$0.577
AE Petsche
Master Electronics
$0.585
$0.561
TTI Europe
$0.483
$0.440
Avnet
$0.665
Interstate Connecting
$0.499
$0.471
DigiKey
$0.955
Verical
Powell Electronics
$0.783
Heilind Electronics
$0.458
$0.451
Future Electronics
Electro Enterprises
$0.669
$0.569
$0.461
Nova Conductors
$0.710
FDH Electronics
$0.744
$0.633
$0.513
Vyrian
Rapid Electronics
$0.742
Bisco
Quittner & Schimek s.r.o.
IBS Electronics
$0.912
$0.856
Beltway Electronics Company
ACDS - Activité Composants Distribution Service
Bristol Electronics
North Shore Components
Rebound Electronics
EMSNET
Chip Stock
Mil-Aero Solutions, Inc.
Electro Mavin
Resion
Kallista Electronics Ltd
Semicontronic
$0.340
$0.332
$0.330
Argo Parts USA
$0.442
$0.428
Aranea Global
$0.696
$0.668
Advanced Electronics
Continental Prestige Electronics
$139.990
$129.370
GreenTree Electronics
Authorized Procurement Solutions
Glotronic Ltd.
EMSNET (Excess)
Assy Fe
Heat Shrinks TMS-SCE-1/4-2.0-9 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
Sangdest Microelectronics (Nanjing)
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
202D232-25-02-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER;
RPS-8-4/2.0-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -30 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
TMS-SCE-1/4-2.0-9
M23053/5-102-0
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
202F232-71/42-0
TE Connectivity's 202F232-71/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135 °C operating temp range, and 0.35" min cable entry. Ideal for applications requiring protection and insulation of wires with up to 0 AWG size and 0.961" max cable entry.
202K153-3-0
The TE Connectivity 202K153-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min operating temp of -55°C. Ideal for applications requiring a min cable entry of 8.4" and accommodating up to 0 AWG wire size with a max cable entry of 20".
NB18932001
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
NB13892001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: DUAL WALL;
NB17842001
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel;
101A031-12-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Material: FLUOROELASTOMER;
222K152-25/225-0
TE Connectivity's 222K152-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 20".
M23053/5-106-9
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
202K153-25-00/86-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
1202083-2
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 5.95 mm;
M23053/5-105-9
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
DCPT-6/3-45-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel;
M23053/5-107-0
Defense Logistics Agency
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: DEF; VDE;
M83519/2-13
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
M83519/1-4
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
ZHTM-3/1.5-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TMS-SCE-3/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
TMS-SCE-1-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
TMS-SCE-1K-1/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
TMS-SCE-1/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1K-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
TMS-SCE-1K-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
TMS-SCE-1/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1K-1-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
TMS-SCE-1K-2-1/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
TMS-SCE-3/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
TMS-SCE-3/16-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
TMS-SCE-1K-1/2-2.0-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
TMS-SCE-1K-1/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
TMS-SCE-3/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1K-3/4-2.0-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
TMS-SCE-1K-3/32-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
TMS-SCE-1K-3/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1K-1/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
TMS-SCE-1K-1/2-2.0-2
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
Supply Digital Components
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Total price ≈ $80,197.29
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