Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER;
Median Price
$2.440
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$2.336
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Netroflash
$2.391
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Heat Shrinks S02-08-R-93CS816 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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Construction:
Diameter:
Terminal Type:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NXP Semiconductors
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
Tak Cheong Electronics Holdings
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
1N4148
Surge Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
Taiwan Semiconductor
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RNF-100-3/16-0-STK
TE Connectivity
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
RNF-100-1/2-0-FSP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
FIT-221-1/2BL016
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
NB17842001
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel;
DR-25-TW-3/16-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED ELASTOMER;
222K132-25-0
TE Connectivity's 222K132-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 5.9". Ideal for applications requiring -75 to 150°C temp range, accommodating up to 0 AWG wire size in a 15" cable entry space.
S200-2-01-100HN
TE Connectivity's S200-2-01-100HN heat shrink features single wall construction with crosslinked modified fluoropolymer jacket. It has a max operating temperature of 200°C, 2.65mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminal connections in various applications requiring reliable insulation and protection.
CY7721-000
TE Connectivity CY7721-000 is a single wall heat shrink made of fluor-elastomer with max operating temp of 200°C and min of -55°C. Ideal for applications requiring protection against extreme temperatures, it accommodates wires up to 0 AWG.
202K142-25-00/225-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
CWT-5-W122-5
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: SINGLE WALL;
MT1000-3/32-0-SP
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
382A012-4/86-0
TE Connectivity's 382A012-4/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min of -55°C, suitable for wire sizes up to 0 AWG. Ideal for various applications requiring reliable insulation and protection.
SO63-3-55-24-90
TE Connectivity's SO63-3-55-24-90 heat shrink features single wall construction with polyvinylidene fluoride jacket material. It has a max operating temperature of 150°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
ES2000-NO.2-B9-0-50MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 130 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
TMS-SCE-1/2-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
M23053/5-111-9
Ls Cable & System
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; Assembly Item Name: TAPER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
222A185-3/42-0
TE Connectivity's 222A185-3/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket material. With a max operating temp of 135°C and min cable entry of 0.799", it suits applications requiring durable insulation for cables up to 0 AWG, with a max cable entry of 2.142".
RPS-1K-18-12/2.0-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Jacket Material: CROSSLINKED POLYOLEFIN;
D-1744-02
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
975269-000
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
S02-03-RCS453
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
S02-08-R-3
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Diameter: 4.3 mm; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
S02-08-R-95
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
S02-08-R-92
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER;
S02-08-R-91
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG;
S02-03-RCS293
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 20 AWG; Wire Gauge (AWG): 20; Terminal Type: SOLDER;
S02-03-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 20 AWG; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 20;
S02-08-R-91CS816
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER; Diameter: 4.3 mm;
S02-08-R-93
S02-03-R-BMS-CS4100
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
S02-03-R-BMS
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
S02-08-R-5CS926
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 4.3 mm;
S02-02-R
HEAT SHRINK SOLDER SLEEVE; Diameter: 2.65 mm; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 20; Maximum Wire Size: 20 AWG; Construction: SINGLE WALL;
S02-08-R-90
S02-08-R-94
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Terminal Type: SOLDER; Construction: SINGLE WALL;
S02-09-RCS453
S02-02-RCR293
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 20 AWG; Terminal Type: SOLDER; Construction: SINGLE WALL; Diameter: 2.65 mm; Wire Gauge (AWG): 20;
S02-05-R
S02-01-R
S02-08-R-90CS816
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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