Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL;
Median Price
$4.848
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Interstate Connecting
1+ parts
100+ parts
$4.064
1k+ parts
$3.838
10k+ parts
-
Heilind Electronics
$7.086
Mouser Electronics
$9.240
$5.840
Verical
$2.940
Arrow
Master Electronics
$4.553
$3.493
$3.467
DigiKey
$5.718
Nova Conductors
$5.051
IBS Electronics
$8.261
$7.377
$4.544
Vyrian
Continental Prestige Electronics
$4.950
Netroflash
$4.799
$4.698
Argo Parts USA
GreenTree Electronics
Assy Fe
FE SAS
Heat Shrinks RW-175-3/16-X-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EU2B-YS303C
Idec
ROTARY SWITCH;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
Gulf Semiconductor
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
DS18B20+
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
M23053/5-111-9
TE Connectivity
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
TMS-SCE-3/16-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
TMS-SCE-1/4-2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
M23053/5-103-9
Ls Cable & System
HEAT SHRINK TUBE; IEC Conformity: NO; Construction: SINGLE WALL; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
M23053/16-004-0
Defense Logistics Agency
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
775210-000
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
NB13434001
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: VDE; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
202K174-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Minimum Cable Entry: .618 inch; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 1.378 inch;
TMS-SCE-1/8-2.0-4
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
222K142-25-00-0
TE Connectivity's 222K142-25-00-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temperature range, and fits cables up to 31" with 0 AWG wire size. Ideal for applications requiring durable cable protection in extreme temperature environments.
358792-003
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
301A034-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
DR-25-1/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Wire Gauge (AWG): 0;
222K142-100/184-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Maximum Cable Entry: 31 inch; Minimum Cable Entry: 19 inch;
FIT-221-1/2BL016
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
222A185-3/42-0
TE Connectivity's 222A185-3/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket material. With a max operating temp of 135°C and min cable entry of 0.799", it suits applications requiring durable insulation for cables up to 0 AWG, with a max cable entry of 2.142".
301A034-3/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
202A111-3-0
TE Connectivity's 202A111-3-0 heat shrink features POLYOLEFIN jacket material, 0.15" min cable entry, and -55 to 135°C operating temp range. Ideal for applications requiring protection and insulation of cables with up to 0 AWG wire size.
M83519/2-17
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
202D132-3-60/42-0
TE Connectivity's 202D132-3-60/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket material. With a max operating temp of 135°C and min cable entry of 0.26", it suits applications requiring durable insulation for cables up to 0 AWG, with a max cable entry of 0.579".
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RW-175-3/64-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED FLUOROPOLYMER; Wire Gauge (AWG): 0;
RW-175-1/16-X-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel;
RW-175-3-64-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel;
RW-175-1/8-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel;
RW-175-E-3/64-X-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel;
RW-175-1/2-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RW-175-3/32-X-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Jacket Material: CROSSLINKED FLUOROPOLYMER; Construction: SINGLE WALL;
RW-175-3/8-X-STK
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel;
RW-175-E-3/16-X-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Minimum Operating Temperature: -55 Cel;
RW-175-3/64-0-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: FLUOROPOLYMER;
RW-175-3/4-X-STK
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
RW-175-E-1/16-X-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
RW-175-E-1/16-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG;
RW-175-1-1/2-X-STK
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RW-175-1/4-X-STK
RW-175-E-3/16-X-SP
RW-175-E-3/64-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
RW-175-3/8-X-1.5IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Construction: SINGLE WALL;
RW-175-3/16-X-SP
RW-175-3/8-X-STK-CS7387
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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