Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
Median Price
$26.490
Lifecycle Status
Suppliers In-Stock
17
In-Stock Inventory
1k+
WireMasters
1+ parts
$23.700
100+ parts
$22.047
1k+ parts
$19.347
10k+ parts
$18.231
RS (Exports)
$25.298
$22.768
-
Farnell
$29.480
$19.430
Newark
$37.890
$30.150
Element14
$38.467
$25.478
$24.519
Master Electronics
$39.640
$24.950
$24.760
Bürklin Elektronik
$42.210
TTI Europe
$13.496
$12.349
Chip1Stop
$25.700
$17.000
PEI Genesis
Verical
$25.938
Powell Electronics
Nova Conductors
$18.179
TME
$33.200
$27.340
IBS Electronics
$46.897
$37.266
$24.041
Vyrian
Rapid Electronics
Netroflash
$17.270
$16.906
Advanced Electronics
$23.229
$21.370
$20.025
Continental Prestige Electronics
$23.650
$20.860
Argo Parts USA
Perfect Parts
Assy Fe
Heat Shrinks HTAT-24/6-0-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Design/Specification - Revision Adjustment 17/APR/2023
PCN Assembly/Origin - Mult Devs Leadtime update 08/APR/2020
PCN Packaging - Mult Devs packaging 06/APR/2020
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Rugao Dachang Electronic
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
Changzhou Galaxy Century Microelectronics
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
M83519/2-13
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
SO96-3-55-22-90-100
TE Connectivity
TE Connectivity's SO96-3-55-22-90-100 heat shrink features single wall construction with Polyvinylidene Fluoride jacket material. It has a max operating temperature of 175°C, diameter of 4.3mm, and supports up to 0 AWG wire size. Ideal for solder terminals in various electrical applications.
222D921-25/225-0
TE Connectivity's 222D921-25/225-0 is an ELASTOMER heat shrink with a min cable entry of 2.1 inch and max operating temperature of 150°C. It is suitable for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 4.6 inch.
222K142-25-0
TE Connectivity's 222K142-25-0 heat shrink features single wall construction with elastomer jacket material. It has a min cable entry of 7.1" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for wires up to 0 AWG size with a max cable entry of 17".
401-52880
Hellermanntyton
HEAT SHRINK BOOT; Jacket Material: ELASTOMER;
381A301-71/42-0
TE Connectivity's 381A301-71/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a max operating temp of 135°C and min of -55°C, it accommodates wires up to 0 AWG. Ideal for electrical insulation in various applications.
RNF-100-1/8-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
202K153-25/225-0
TE Connectivity's 202K153-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a max operating temp of 150°C and min operating temp of -75°C, suitable for cables up to 0 AWG size. Ideal for applications requiring a min cable entry of 8.4 inches and max cable entry of 20 inches.
M83519/2-8
Sumitomo Electric Industries
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE;
DR-25-3/4-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Construction: SINGLE WALL;
NB14494001
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0;
RT-375-1-4-X-SP
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel;
RNF-100-3/16-X-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
RNF-100-3/16-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
202A142-3/86-0
TE Connectivity's 202A142-3/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a min cable entry of 0.291" and can withstand temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 1".
FIT-221-3/16BK002
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: CSA; UL;
B-155-07-S
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
ZHTM-8/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CHLORINATED POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
202K132-100-01/180-0
HEAT SHRINK BOOT; Minimum Cable Entry: 5.9 inch; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 15 inch;
S02-10-RCS453
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HTAT-4/1-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-8/2-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
HTAT-32/8-0-SP
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0;
HTAT-48/13-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel;
HTAT-24/6-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
HTAT-16/4-0-STK
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
HTAT-32/8-0-50MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN;
HTAT-32/8-0-110MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-40MM
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-42MM
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-65MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
HTAT-32/8-0-85MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN;
HTAT-8-2-0-SP
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
HTAT-8/2-0-10MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
HTAT-8/2-0-30MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
HTAT-8/2-0-50MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
HTAT-8/2-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
HTAT-24/6-0-60MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL;
HTAT-24/6-0-100MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
Supply Digital Components
$106.00
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Quantity
12,000 In-Stock
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