Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel;
Median Price
$19.170
Lifecycle Status
Suppliers In-Stock
15
In-Stock Inventory
1k+
Farnell
1+ parts
$17.270
100+ parts
$12.550
1k+ parts
$11.680
10k+ parts
-
DigiKey
$18.360
$12.439
RS (Exports)
$23.752
$21.351
Newark
$28.280
$19.000
Element14
$36.370
$22.510
$21.610
Master Electronics
$37.450
$17.870
$17.780
TTI Europe
$10.617
Chip1Stop
$17.200
Verical
Powell Electronics
Nova Conductors
$15.340
TME
$22.690
$18.690
IBS Electronics
$52.524
$25.063
$24.936
Rapid Electronics
Vyrian
Aranea Global
$15.033
$14.432
Continental Prestige Electronics
$18.480
$16.290
Argo Parts USA
Assy Fe
Heat Shrinks HTAT-16/4-0-STK attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Obsolescence/ EOL - Versafit series obsolete 05/APR/2019
PCN Design/Specification - Revision Adjustment 16/JUN/2023
PCN Assembly/Origin - Mult Devs Leadtime update 08/APR/2020
PCN Packaging - Mult Devs packaging 06/APR/2020
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
Vishay Telefunken
1N4148
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
Changzhou Galaxy Century Microelectronics
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
S02-08-R-93
TE Connectivity
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER;
202F232-71/42-0
TE Connectivity's 202F232-71/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135 °C operating temp range, and 0.35" min cable entry. Ideal for applications requiring protection and insulation of wires with up to 0 AWG size and 0.961" max cable entry.
RT555-1-0-SP-CS7501
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER;
VERSAFIT-1-1/2-0-SP
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Construction: SINGLE WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
202K163-3-02-0
TE Connectivity's 202K163-3-02-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135 °C operating temp range, and fits cables up to 23 inch. Ideal for protecting wires in industrial applications with 0 AWG wire size requirements.
M83519/2-3
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
TMS-SCE-1K-3/32-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
TC-CAPS-4005-8
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN;
D-101-00-WOTI
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
XFFR-04X4
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
342A012-25/42-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Construction: DUAL WALL; Material: ELASTOMER;
M23053/5-103-9
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0;
RNF-100-3/64-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
D-1744-02
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
FIT-221-3/16BK002
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: CSA; UL;
202K142-25-00/225-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
TMS-SCE-1K-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
RPS-6-250/2.0-4
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel;
HTAT-8/2-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
FIT-221-1/8WH002
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Jacket Material: POLYOLEFIN;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HTAT-24/6-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
HTAT-4/1-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-SP
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0;
HTAT-48/13-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel;
HTAT-24/6-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
HTAT-32/8-0-50MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN;
HTAT-32/8-0-110MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-40MM
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-42MM
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-65MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
HTAT-32/8-0-85MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
HTAT-32/8-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN;
HTAT-8-2-0-SP
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
HTAT-8/2-0-10MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
HTAT-8/2-0-30MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
HTAT-8/2-0-50MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
HTAT-8/2-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
HTAT-16/4-0-40MM
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0;
HTAT-16/4-0-30MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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