Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's 202F232-71/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, -55 to 135 °C operating temp range, and 0.35" min cable entry. Ideal for applications requiring protection and insulation of wires with up to 0 AWG size and 0.961" max cable entry.
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Master Electronics
$49.010
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$30.800
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$15.332
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VNN
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$20.462
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$14.946
$14.647
AZTECH Wire
$16.160
Argo Parts USA
Advanced Electronics
Assy Fe
The use of semi-rigid polyolefin for the jacket material provides durability and protection to the cables, making this product a reliable choice for long-term use.
The minimum cable entry size of 0.35 inch allows for easy installation and flexibility in accommodating various cable sizes, making it versatile for different applications.
With a high maximum operating temperature of 135°C, this heat shrink is suitable for use in environments where heat resistance is crucial, ensuring reliable performance even in demanding conditions.
The low minimum operating temperature of -55°C means that this heat shrink can withstand extremely cold temperatures without compromising its functionality, making it suitable for a wide range of environments.
The compatibility with up to 0 AWG wire size allows for versatility in use, accommodating different wire sizes and making this product a practical choice for various applications.
The maximum cable entry size of 0.961 inch provides flexibility in accommodating larger cables, making this heat shrink suitable for a wide range of cable sizes and types.
The use of polyolefin as the main material ensures insulation and protection for cables, making this heat shrink a reliable choice for maintaining the integrity of electrical connections.
Heat Shrinks 202F232-71/42-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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PCN Design/Specification - 202yyy Title Block 12/Mar/2014
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Philips Components
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Brightking
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
FDLL4148
Onsemi
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Meritek Electronics
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1N4148WT
Diodes Incorporated
222K152-25/225-0
TE Connectivity
TE Connectivity's 222K152-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 20".
562A011-3/42-0
TE Connectivity's 562A011-3/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a temperature range of -55 to 135°C, it accommodates wires up to 0 AWG. Ideal for electrical insulation and protection in various applications.
CGPT-6.4/3.2-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
HT-SCE-1/8-2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 225 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
D-1744-01-LF
HEAT SHRINK SOLDER SLEEVE; Minimum Operating Temperature: -55 Cel; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel;
761618-000
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Minimum Cable Entry: .339 inch; Maximum Cable Entry: 1.031 inch; Maximum Operating Temperature: 105 Cel;
RT-770-3/8-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 125 Cel; Jacket Material: CROSSLINKED FLUOROELASTOMER; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
M23053/5-104-0
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0;
RNF-100-3/16-BK-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
M83519/2-17
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M23053/5-103-0
Ls Cable & System
HEAT SHRINK TUBE; DIN Conformity: NO; IEC Conformity: NO; Assembly Item Name: TAPER SLEEVE; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO;
M23053/5-109-9
HEAT SHRINK TUBE; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; IEC Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN;
NB24322001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
ATUM-16/4-0-STK
Commscope
HEAT SHRINK TUBE; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 110 Cel; Wire Gauge (AWG): 0;
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
ST18-5-9039
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
RNF-100-3/16-BK-SP-CS5004
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE;
RNF-100-1-1/2-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel;
491908-003
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER;
TTMS-2.4-9
HEAT SHRINK TUBE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
202F211-71/180-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
202F211-50-0
TE Connectivity's 202F211-50-0 heat shrink features ELASTOMER jacket material, 0.26" min cable entry, and 150°C max operating temp. Ideal for -55°C to 0.614" cable entry applications with 0 AWG wire size requirements.
202F221-51/164-0
TE Connectivity's 202F221-51/164-0 heat shrink features a FLUORO-ELASTOMER jacket material and can accommodate cables with a min entry of 0.299 inch and max entry of 0.689 inch. With an operating temperature range from -55 to 135 °C, it is suitable for various applications requiring reliable cable insulation.
202F242-50-22-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel;
202F274-51/164-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUORO-ELASTOMER; Maximum Operating Temperature: 135 Cel; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG;
202F211-51-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
202F221-51-22/164-0
HEAT SHRINK BOOT; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER; Maximum Wire Size: 0 AWG;
202F221-51-02/164-0
HEAT SHRINK BOOT; Material: FLUOROELASTOMER; Jacket Material: FLUORO-ELASTOMER; Maximum Cable Entry: 1.07 inch; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
202F232-50-0
HEAT SHRINK BOOT; Maximum Cable Entry: .961 inch; Minimum Cable Entry: .35 inch; Jacket Material: ELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
202F242-71/42-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Cable Entry: .402 inch; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 1.13 inch;
202F221-71-22/42-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN;
202F232-71/180-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
202F274-71-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN;
202F221-71/86-0
HEAT SHRINK BOOT; Minimum Cable Entry: .299 inch; Maximum Operating Temperature: 135 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Cable Entry: .689 inch;
202F232-71-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Jacket Material: SEMI-RIGID POLYOLEFIN;
202F221-71-22/86-0
HEAT SHRINK BOOT; Jacket Material: SEMI-RIGID POLYOLEFIN; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
202F232-71/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .35 inch; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
202F232-71-10/42-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN;
202F221-71-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Cable Entry: .299 inch; Maximum Cable Entry: .689 inch; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
202F232-51-0
HEAT SHRINK BOOT; Maximum Cable Entry: .961 inch; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .35 inch; Material: FLUOROELASTOMER;
Supply Digital Components
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