Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK CAP; Construction: MEDIUM WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Material: FLUOROELASTOMER;
Median Price
$10.460
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Master Electronics
1+ parts
-
100+ parts
$8.810
1k+ parts
$7.220
10k+ parts
Verical
$10.770
$10.461
Powell Electronics
$10.150
Chip1Stop
$100.340
Nova Conductors
$7.906
VNN
IBS Electronics
$12.458
$10.209
Vyrian
Aranea Global
$7.748
$7.438
Continental Prestige Electronics
$7.830
$7.673
Argo Parts USA
Advanced Electronics
Heat Shrinks 101A031-12-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Yangzhou Yangjie Electronics
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
National Semiconductor
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
Dc Components
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
ABS10-32.768KHZ-T
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
ATUM-32/8-0-STK
TE Connectivity
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
FIT-221-1/16CL001
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
DR-25-1/8-0
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-100-1/16-RD-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL;
ES2000-NO.4-B7-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 130 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG;
809S060-2R
Glenair
HEAT SHRINK BOOT; Jacket Material: ELASTOMER;
RNF-100-1/8-YO-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
RHW-34/8-1200/ADH-0
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
FIT-221-3/16RD002
HEAT SHRINK TUBE; Additional Features: CSA; UL; Jacket Material: POLYOLEFIN;
RNF-100-3/16-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
ES2000-NO.2-B9-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 130 Cel; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG;
TMS-SCE-1K-3/32-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
S01-04-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
M23053/5-102-0
Defense Logistics Agency
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
RT-375-1/8-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
NB20034001
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
15170
Pro-power
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
204W221-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
S02-02-W3-22-00-100
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
RNF-100-1/8-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
101A031-100/180-0
HEAT SHRINK CAP; Minimum Operating Temperature: -30 Cel; Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: BR; VG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
101A021-4-0
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: MEDIUM WALL;
101A073-100/180-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: BR; VG; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN;
101A041-100/180-0
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Construction: MEDIUM WALL; Material: POLYOLEFIN;
101A021-4/42-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
101A062-3/86-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN;
101A073-3/42-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: MEDIUM WALL; Material: POLYOLEFIN;
101A073-3-0
101A083-4-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Construction: MEDIUM WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
101A041-3/42-0
HEAT SHRINK CAP; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Construction: MEDIUM WALL; Maximum Operating Temperature: 135 Cel;
101A052-3/42-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
101A021-3/42-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Construction: MEDIUM WALL; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
101A041-4-0
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Construction: MEDIUM WALL; Maximum Operating Temperature: 135 Cel;
101A031-3/42-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Construction: MEDIUM WALL;
101A083-12-0
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Material: FLUOROELASTOMER; Construction: MEDIUM WALL; Jacket Material: FLUORO-ELASTOMER; Maximum Operating Temperature: 200 Cel;
101A073-3/86-0
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; UL; Construction: MEDIUM WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
101A031-3/86-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; UL; Material: POLYOLEFIN;
101A041-4/42-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Construction: MEDIUM WALL; Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; Jacket Material: POLYOLEFIN;
101A031-4/42-0
HEAT SHRINK CAP; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; Minimum Operating Temperature: -55 Cel; Construction: MEDIUM WALL;
101A083-3/86-0
HEAT SHRINK CAP; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; UL; Material: POLYOLEFIN;
Supply Digital Components
$106.00
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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