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URG2012L-1820-D-T1

Susumu

URG2012L-1820-D-T1 by Susumu

FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 182 ohm; Rated Power Dissipation (P): .1 W; Maximum Operating Temperature: 155 Cel; Tolerance: .5 %;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Fixed Resistors URG2012L-1820-D-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ANTI-SULFUR

Construction:

Rectangular

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.4 mm

Length (Package):

2 mm

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR, PAPER, 7 INCH

Rated Power Dissipation (P):

Rated Temperature:

70 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

0805

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

2

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

150 V

Trade Compliance

URG2012L-1820-D-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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