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RM3216B-102/902-PBVB50

Susumu

RM3216B-102/902-PBVB50 by Susumu

ARRAY/NETWORK RESISTOR; Mounting Type: SURFACE MOUNT; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 155 Cel; Tolerance: .1 %; First Element Resistance: 1000 ohm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Resistor Networks & Arrays RM3216B-102/902-PBVB50 attributes and parameters. Explore more Resistor Networks & Arrays devices from Susumu

Specs

Construction:

Rectangular

Element Power Dissipation:

.063 W

First Element Resistance:

1000 ohm

Mounting Type:

Network Type:

ISOLATED

No. of Elements:

1

No. of Functions:

2

No. of Terminals:

4

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.45 mm

Length (Package):

3.2 mm

Package Style (Meter):

SMT

Width (Package):

1.6 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistor Type:

Second or Last Element Resistance:

9000 ohm

Size Code:

1206

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Temperature Coef Tracking:

5 ppm/Cel

Terminal Shape:

WRAPAROUND

Tolerance:

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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