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RG3216P-49R9-B-T1

Susumu

RG3216P-49R9-B-T1 by Susumu

Susumu's RG3216P-49R9-B-T1 is a chip resistor with 49.9 ohm resistance, 0.1% tolerance, and 0.25 W power dissipation. Ideal for SMT applications, it operates b/w -55 to 155 °C and has a temperature coefficient of 25 ppm/°C.

Median Price

$0.315

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Mouser Electronics

USA . 2,281 parts In-Stock

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$0.240

100+ parts

$0.167

1k+ parts

$0.126

10k+ parts

$0.123

2,281

$0.240

$0.167

$0.126

$0.123

DigiKey

USA . 9,321 parts In-Stock

1+ parts

$0.390

100+ parts

$0.196

1k+ parts

$0.105

10k+ parts

-

9,321

$0.390

$0.196

$0.105

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Perfect Parts

USA . 15,790 parts In-Stock

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15,790

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QUARKTWIN TECHNOLOGY LTD

USA . 7,103 parts In-Stock

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100+ parts

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7,103

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Overview

When it comes to top-quality fixed resistors, the Susumu RG3216P-49R9-B-T1 stands out from the rest. Manufactured by a trusted name in the industry, this metal film resistor is perfect for a wide range of applications. With precision engineering and a high level of reliability, customers can trust that they are getting a product that will meet their needs every time. Whether you're looking for accuracy, durability, or efficiency, the Susumu RG3216P-49R9-B-T1 delivers it all. Trust in Susumu for all your resistor needs and experience the difference in quality for yourself.

Feature Benefit Bullets

Rated Temperature: 85 °C

With a rated temperature of 85 °C, this fixed resistor can operate within a wide temperature range, making it suitable for various applications.

Resistance: 49.9 ohm

The precise resistance of 49.9 ohm with a tolerance of 0.1% ensures accurate and reliable performance in electronic circuits.

Maximum Operating Temperature: 155 °C

The high maximum operating temperature of 155 °C allows this resistor to withstand elevated temperature environments without compromising its performance.

Temperature Coef (ppm/°C): 25

With a low temperature coefficient of 25 ppm/°C, this resistor maintains its resistance value over a wide temperature range, ensuring stable performance.

Rated Power Dissipation (P): 0.25 W

The rated power dissipation of 0.25 W allows this fixed resistor to handle moderate power loads, making it suitable for various electronic applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection in the circuit.

Technical Specifications

Fixed Resistors RG3216P-49R9-B-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ULTRA PRECISION

Construction:

Chip

JESD-609 Code:

e3

Manufacturer Series:

RG

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

3.2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.6 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Resistance:

Resistor Type:

Series:

RG3216(NP TC,WB TOL)

Size Code:

1206

Sub-Category:

Fixed Resistors

Technology:

METAL FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

Matte Tin (Sn)

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

150 V

Trade Compliance

RG3216P-49R9-B-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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