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RG2012P-4642-D-T5

Susumu

RG2012P-4642-D-T5 by Susumu

The Susumu RG2012P-4642-D-T5 is a thin film fixed resistor with 46400 ohm resistance, 0.5% tolerance, and 0.125 W power dissipation. It is used in surface mount applications for automotive electronics due to its AEC-Q200 reference standard compliance and operating voltage of 150 V.

Median Price

$0.038

Lifecycle Status

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2

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1k+

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Nova Conductors

Japan . 26 parts In-Stock

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Vyrian

USA . 7,317 parts In-Stock

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Semicontronic

India . 981 parts In-Stock

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981

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Continental Prestige Electronics

USA . 5,525 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Argo Parts USA

USA . 170 parts In-Stock

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Corohmni

South Africa . 544 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,397 parts In-Stock

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$0.470

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AZTECH Wire

Italy . 210 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Experience the superior quality and reliability of Susumu's RG2012P-4642-D-T5 fixed resistor. With a precision thin film technology, this rectangular package resistor offers unmatched performance in a compact design. Ideal for a wide range of applications, from automotive to industrial electronics, this resistor ensures consistent and accurate resistance values. Trust Susumu's expertise and innovation to provide you with the value and benefits you need for your next project.

Feature Benefit Bullets

Rated Temperature: 85 °C

Ability to operate at high temperatures makes this resistor suitable for a wide range of applications.

Technology: THIN FILM

Thin film technology offers better stability and accuracy compared to thick film, making this resistor a reliable choice.

Resistance: 46400 ohm

Offers a specific resistance value that is commonly used in electronic circuits for precise voltage and current control.

Tolerance: 0.5 %

Low tolerance ensures consistency and accuracy in resistance values, crucial for stable performance in circuits.

Operating Voltage: 150 V

Suitable for a wide range of voltage applications while maintaining stable resistance values.

Rated Power Dissipation (P): 0.125 W

Capable of dissipating power efficiently without overheating, ensuring long-term reliability.

Technical Specifications

Fixed Resistors RG2012P-4642-D-T5 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ANTI-SULFUR, HIGH PRECISION

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.4 mm

Length (Package):

2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR, PAPER, 7 INCH

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

0805

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

150 V

Trade Compliance

RG2012P-4642-D-T5 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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