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RG1608P-1820-B-T5

Susumu

RG1608P-1820-B-T5 by Susumu

Susumu's RG1608P-1820-B-T5 is a thin film fixed resistor with 182 ohm resistance, 0.1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 100V.

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1k+

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Vyrian

USA . 6,836 parts In-Stock

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Nova Conductors

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10

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Aztec Data Supply Inc.

USA . 1,794 parts In-Stock

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$0.375

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$0.375

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Corohmni

South Africa . 135 parts In-Stock

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$0.465

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AZTECH Wire

Italy . 625 parts In-Stock

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$14.952

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625

$14.952

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Argo Parts USA

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Aranea Global

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Continental Prestige Electronics

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Overview

Enhance your electronic devices with the top-notch quality of the Susumu RG1608P-1820-B-T5 fixed resistor. As a leading manufacturer in the industry, Susumu's thin film technology ensures superior performance and reliability. Ideal for a wide range of applications, this rectangular package resistor offers precise resistance values and a low temperature coefficient for optimal functionality. Trust Susumu to deliver exceptional value, benefits, and advantages to customers looking for reliable components that meet the highest standards of quality and performance.

Feature Benefit Bullets

Rated Temperature: 85 °C

This resistor can operate at a wide range of temperatures, making it suitable for various applications.

Technology: THIN FILM

Thin film technology ensures high precision and stability in the resistance value, making this resistor reliable for use.

Resistance: 182 ohm

With a specific resistance value, this resistor can be used in circuits that require a precise resistance level.

Max Operating Temperature: 155 °C

With a high maximum operating temperature, this resistor can withstand high temperatures without compromising its performance.

Tolerance: 0.1 %

The low tolerance value indicates that this resistor provides accurate resistance values, crucial for precise circuit design.

Rated Power Dissipation (P): 0.1 W

This resistor has a low power dissipation rating, making it suitable for low-power applications where energy efficiency is important.

Mounting Type: SURFACE MOUNT

The surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Technical Specifications

Fixed Resistors RG1608P-1820-B-T5 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ANTI-SULFUR, HIGH PRECISION

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.4 mm

Length (Package):

1.6 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

.8 mm

Packing Method:

TR, PAPER, 7 INCH

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

0603

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

100 V

Trade Compliance

RG1608P-1820-B-T5 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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