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RG1608N-393-W-T5

Susumu

RG1608N-393-W-T5 by Susumu

Susumu's RG1608N-393-W-T5 is a thin film fixed resistor with 39000 ohm resistance, 0.05% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 100 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,557 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,288 parts In-Stock

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$0.100

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$0.100

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Corohmni

South Africa . 1 parts In-Stock

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$0.255

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AZTECH Wire

Italy . 895 parts In-Stock

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$15.255

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895

$15.255

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Kepictronics

USA . 77,400 parts In-Stock

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Authorized Procurement Solutions

USA . 12,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,544 parts In-Stock

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Argo Parts USA

USA . 2,040 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the high-quality RG1608N-393-W-T5 fixed resistor by Susumu. As a trusted manufacturer in the industry, Susumu ensures top-notch reliability and precision in every component. Ideal for a wide range of applications, this thin film resistor offers exceptional value, providing customers with precise resistance and stable operation even in extreme temperatures. Upgrade your electronics with the RG1608N-393-W-T5 and experience enhanced functionality and longevity.

Feature Benefit Bullets

Rated Temperature: 85 °C

This product can operate efficiently at high temperatures, making it suitable for various applications.

Technology: THIN FILM

Thin film technology provides high precision and stability, ensuring accurate resistance values over time.

Resistance: 39000 ohm

With a resistance of 39000 ohms, this product can be used in circuits that require specific resistance values.

Operating Voltage: 100 V

Capable of handling up to 100 volts, making it suitable for a wide range of voltage requirements.

Tolerance: 0.05 %

High tolerance of 0.05% ensures accurate resistance matching in critical applications.

Mounting Type: SURFACE MOUNT

Surface mount design allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Technical Specifications

Fixed Resistors RG1608N-393-W-T5 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ANTI-SULFUR, HIGH PRECISION

Construction:

Rectangular

JESD-609 Code:

e3

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.4 mm

Length (Package):

1.6 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

.8 mm

Packing Method:

TR, PAPER, 7 INCH

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Reference Standard:

AEC-Q200

Resistance:

Resistor Type:

Size Code:

0603

Technology:

THIN FILM

Temperature Coef (ppm/Cel):

10

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

100 V

Trade Compliance

RG1608N-393-W-T5 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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