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PAT0510S-C-5DB-T10

Susumu

PAT0510S-C-5DB-T10 by Susumu

FIXED ATTENUATOR; Maximum Operating Frequency: 10000 MHz; Maximum Input Power (CW): 15.05 dBm; Characteristic Impedance: 50 ohm; Maximum Voltage Standing Wave Ratio: 1.3; Minimum Operating Temperature: -55 Cel;

Median Price

$0.110

Lifecycle Status

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8

In-Stock Inventory

1k+

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DigiKey

USA . 113,533 parts In-Stock

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$0.110

100+ parts

$0.082

1k+ parts

$0.070

10k+ parts

$0.061

113,533

$0.110

$0.082

$0.070

$0.061

Mouser Electronics

USA . 15,781 parts In-Stock

1+ parts

$0.110

100+ parts

$0.081

1k+ parts

$0.070

10k+ parts

$0.059

15,781

$0.110

$0.081

$0.070

$0.059

Chip1Stop

Japan . 11 parts In-Stock

1+ parts

-

100+ parts

$0.041

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$0.041

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$0.041

11

-

$0.041

$0.041

$0.041

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NAC Semi

USA . 20,000 parts In-Stock

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100+ parts

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$0.074

20,000

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$0.074

IBS Electronics

USA . 10,000 parts In-Stock

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100+ parts

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1k+ parts

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$0.058

10,000

-

-

-

$0.058

Sunrise Surplus Inc.

USA . 9,980 parts In-Stock

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9,980

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-

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Speed Components Ltd

Israel . 8,898 parts In-Stock

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8,898

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Semtec, LLC

USA . 1,600 parts In-Stock

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1,600

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Perfect Parts

USA . 50,635 parts In-Stock

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50,635

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Technical Specifications

RF/Microwave Attenuators PAT0510S-C-5DB-T10 attributes and parameters. Explore more RF/Microwave Attenuators devices from Susumu

Specs

Nominal Attenuation:

5 dB

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

15.05 dBm

JESD-609 Code:

e3

Maximum Operating Frequency:

10000 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

RF or Microwave Device Type:

Terminal Finish:

Matte Tin (Sn)

Maximum Voltage Standing Wave Ratio:

1.3

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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