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KRL1220-C-R051-F-T1

Susumu

KRL1220-C-R051-F-T1 by Susumu

Susumu's KRL1220-C-R051-F-T1 is a METAL FOIL fixed resistor with 0.051 ohm resistance, 1% tolerance, and 0.3 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 170 °C with a temperature coefficient of 50 ppm/°C.

Median Price

$0.095

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.095

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10

$0.095

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Vyrian

USA . 1,509 parts In-Stock

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1,509

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.095

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2,000

$0.095

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AZTECH Wire

Italy . 761 parts In-Stock

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$7.355

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761

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Overview

Susumu offers a wide range of thin film chip resistors, including its core product, the RG series. The RG series are precise and reliable thin film chip resistors. Susumu also offers excellent current sensing chip resistors, such as the KRL series.

Feature Benefit Bullets

Technology: METAL FOIL

Metal foil technology provides high precision and stability in resistance values, making this resistor reliable for various applications.

Construction: Rectangular

Rectangular construction allows for easy placement and secure mounting on circuit boards, ensuring a stable connection.

Packing Method: TR, EMBOSSED, 7 INCH

The embossed 7-inch tape packaging method ensures convenient handling and compatibility with automated assembly processes, saving time and effort in production.

Resistance: 0.051 ohm

With a low resistance value, this resistor is suitable for applications requiring precise current limiting and voltage division.

Maximum Operating Temperature: 170 °C

The high maximum operating temperature allows this resistor to withstand challenging environmental conditions, ensuring reliability in diverse settings.

Tolerance: 1 %

The tight tolerance of 1% ensures accurate and consistent performance, making this resistor suitable for precision circuits and applications.

Mounting Type: SURFACE MOUNT

Surface mounting type enables easy and efficient PCB integration, saving space and facilitating automated assembly processes.

Technical Specifications

Fixed Resistors KRL1220-C-R051-F-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

PRECISION

Construction:

Rectangular

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

2 mm

Package Style (Meter):

SMT

Width (Package):

1.25 mm

Packing Method:

TR, EMBOSSED, 7 INCH

Rated Power Dissipation (P):

Resistance:

Resistor Type:

Size Code:

0805

Technology:

METAL FOIL

Temperature Coef (ppm/Cel):

50

Terminal Shape:

ONE SURFACE

Tolerance:

1 %

Trade Compliance

KRL1220-C-R051-F-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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