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KRL11050-C-R007-F-T1

Susumu

KRL11050-C-R007-F-T1 by Susumu

FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: .007 ohm; Rated Power Dissipation (P): 5 W; Maximum Operating Temperature: 170 Cel; Tolerance: 1 %;

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 997 parts In-Stock

1+ parts

$2.070

100+ parts

$0.752

1k+ parts

$0.623

10k+ parts

$0.566

997

$2.070

$0.752

$0.623

$0.566

Technical Specifications

Fixed Resistors KRL11050-C-R007-F-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

PRECISION

Construction:

Rectangular

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

11 mm

Package Style (Meter):

SMT

Width (Package):

5 mm

Packing Method:

TR, EMBOSSED, 13 INCH

Rated Power Dissipation (P):

5 W

Resistance:

Resistor Type:

Size Code:

4320

Technology:

METAL FOIL

Temperature Coef (ppm/Cel):

50

Terminal Shape:

ONE SURFACE

Tolerance:

1 %

Trade Compliance

KRL11050-C-R007-F-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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