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VNV49N0413TR

STMicroelectronics

VNV49N0413TR by STMicroelectronics

VNV49N0413TR by STMicroelectronics is a robust peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It operates in extreme temperatures from -40 °C to 125 °C and features an open-drain output with a peak current limit of 49A. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,452 parts In-Stock

1+ parts

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7,452

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Digiode

USA . 4,243 parts In-Stock

1+ parts

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1k+ parts

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4,243

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Q Components

USA . 550 parts In-Stock

1+ parts

-

100+ parts

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550

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Anansix

USA . 142 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 108 parts In-Stock

1+ parts

$4.488

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$4.488

-

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AZTECH Wire

Italy . 489 parts In-Stock

1+ parts

$9.270

100+ parts

-

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489

$9.270

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IDEA Electronic Components Group

UK . 1,896 parts In-Stock

1+ parts

$13.491

100+ parts

-

1k+ parts

$12.142

10k+ parts

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1,896

$13.491

-

$12.142

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MKK Technologies

India . 1,550 parts In-Stock

1+ parts

$25.369

100+ parts

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1,550

$25.369

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DigiPath Technology Company

USA . 1,550 parts In-Stock

1+ parts

$25.369

100+ parts

-

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1,550

$25.369

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Component Stockers USA

USA . 328 parts In-Stock

1+ parts

$99.990

100+ parts

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328

$99.990

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Corphita

USA . 2,171 parts In-Stock

1+ parts

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2,171

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Parana Technologies

USA . 1,682 parts In-Stock

1+ parts

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100+ parts

$16.130

1k+ parts

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1,682

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$16.130

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Overview

Elevate your projects with the VNV49N0413TR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust peripheral driver ensures reliability across automotive applications, boasting built-in protections against overcurrent, overvoltage, and thermal risks. With its compact design and exceptional performance, it’s perfect for demanding environments. Trust in STMicroelectronics' commitment to quality and experience unmatched durability and efficiency that drives your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures good protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier installation and integration into compact designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the circuit board, enhancing design efficiency.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protection features enhance reliability and safety, reducing the risk of damage during operation.

No. of Terminals: 10

Having 10 terminals provides flexibility for various connections, making it versatile for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, allowing for a compact footprint.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliability in demanding environments, suitable for automotive applications.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for multiple devices to connect to a single line, enhancing circuit design flexibility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in extreme cold conditions, perfect for automotive use.

Terminal Finish: Matte Tin (Sn) - annealed

A matte tin finish enhances solderability, ensuring dependable connections during assembly.

Terminal Position: DUAL

The dual terminal position provides a balanced layout, improving electrical performance and reducing interference.

Maximum Seated Height: 3.75 mm

A low seated height contributes to a sleek profile, ideal for modern, compact electronic designs.

Width: 7.5 mm

A compact width ensures compatibility with narrow PCB layouts, maintaining design integrity.

Output Polarity: TRUE

True output polarity simplifies interfacing with other digital logic devices, enhancing compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable peak reflow time ensures that the component can withstand soldering processes without damage.

Peak Reflow Temperature °C: 250

A peak reflow temperature threshold accommodates common soldering techniques, ensuring compatibility in production.

Length: 9.4 mm

A compact length allows for efficient use of space within electronic assemblies, aiding in design simplicity.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets stringent reliability standards for vehicle use.

Technology: MOS

Using MOS technology offers low power consumption and high efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and maintenance, improving reliability in assembly.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics enhance signal integrity in noisy environments, ensuring reliable operation.

Turn-on Time: 3.8 us

A quick turn-on time enhances performance in time-sensitive applications, ensuring responsiveness.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates compatibility with common PCB designs, easing integration.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a reasonable handling precaution, ensuring durability during assembly.

Nominal Output Peak Current Limit: 49 A

A high output peak current limit supports a variety of load requirements, allowing for greater design flexibility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter peripheral driver makes the product versatile for interfacing applications, enhancing its utility.

Turn-off Time: 24 us

A moderate turn-off time ensures adequate response for switching applications, promoting reliable operation.

Output Current Flow Direction: SINK

The sink current flow direction allows for simplified control in many applications, making it easy to integrate into existing designs.

Technical Specifications

Peripheral Drivers VNV49N0413TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

49 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

24 us

Turn-on Time:

3.8 us

Width:

7.5 mm

Trade Compliance

VNV49N0413TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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