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VNV28N04TR-E

STMicroelectronics

VNV28N04TR-E by STMicroelectronics

VNV28N04TR-E by STMicroelectronics is a N-CHANNEL FET with 28A max drain current and 83W power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as automotive systems and industrial controls.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,294 parts In-Stock

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13,294

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Anansix

USA . 934 parts In-Stock

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934

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Digiode

USA . 218 parts In-Stock

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218

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 157 parts In-Stock

1+ parts

$1.671

100+ parts

-

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$1.504

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157

$1.671

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$1.504

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MKK Technologies

India . 970 parts In-Stock

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$3.142

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970

$3.142

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DigiPath Technology Company

USA . 970 parts In-Stock

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$3.142

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970

$3.142

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Microchip USA

USA . 335 parts In-Stock

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$4.354

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335

$4.354

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AZTECH Wire

Italy . 854 parts In-Stock

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$17.160

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854

$17.160

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RC Electronics

USA . 15,202 parts In-Stock

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15,202

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A-Z Elektronik GmbH

Germany . 4,830 parts In-Stock

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4,830

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Corphita

USA . 4,062 parts In-Stock

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4,062

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Kepictronics

USA . 2,488 parts In-Stock

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2,488

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Parana Technologies

USA . 2,274 parts In-Stock

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$1.998

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2,274

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$1.998

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Authorized Procurement Solutions

USA . 1,800 parts In-Stock

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1,800

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Assy Fe

Spain . 1,200 parts In-Stock

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Overview

Elevate your power management solutions with the VNV28N04TR-E by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors that are reliable and efficient. This N-CHANNEL FET offers enhanced performance and versatility for various applications. With a maximum drain current of 28A and a maximum power dissipation of 83W, this transistor is designed to meet your power needs while maintaining optimal functionality. Trust STMicroelectronics to provide you with high-quality components that offer exceptional value and benefits to your projects.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-Channel FETs typically have lower on-state resistance, higher current capabilities, and faster switching speeds than P-Channel FETs, making them suitable for high-power applications.

Configuration SINGLE

Single configuration makes it easy to integrate into circuits and provides a simple setup for applications.

Surface Mount YES

Surface mount capability allows for easy installation on circuit boards, saving space and enabling automated manufacturing processes.

Operating Mode ENHANCEMENT MODE

Enhancement mode operation provides precise control over the FET's conductivity, leading to efficient power management.

Maximum Drain Current (Abs) (ID) 28 A

High maximum drain current rating of 28A allows for reliable operation in high current applications without the risk of overload.

Maximum Power Dissipation (Abs) 83 W

High power dissipation rating of 83W ensures the FET can handle high power loads without overheating.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and reliability, making the FET suitable for demanding applications.

Maximum Operating Temperature 150 °C

High maximum operating temperature of 150 °C ensures the FET can function reliably in harsh environments without thermal failure.

Terminal Finish MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Moisture Sensitivity Level (MSL) 3

Moisture Sensitivity Level 3 indicates the FET is suitable for surface mount assembly without the need for moisture precautions during storage and handling.

Maximum Time At Peak Reflow Temperature (s) 30

Maximum time at peak reflow temperature of 30 seconds allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C 250

Peak reflow temperature of 250 °C ensures robust solder connections and compatibility with standard reflow soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) VNV28N04TR-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VNV28N04TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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