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VNS7NV04P-E

STMicroelectronics

VNS7NV04P-E by STMicroelectronics

VNS7NV04P-E by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features an 8-terminal design with a max output peak current of 9 A and operates efficiently in various applications. Ideal for buffer or inverter-based systems, it ensures reliable performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,636

-

-

-

-

Digiode

USA . 3,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,023

-

-

-

-

Anansix

USA . 2,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,797

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,320 parts In-Stock

1+ parts

$6.078

100+ parts

-

1k+ parts

$5.470

10k+ parts

-

2,320

$6.078

-

$5.470

-

MKK Technologies

India . 643 parts In-Stock

1+ parts

$11.428

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$11.428

-

-

-

DigiPath Technology Company

USA . 643 parts In-Stock

1+ parts

$11.428

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$11.428

-

-

-

AZTECH Wire

Italy . 1,217 parts In-Stock

1+ parts

$22.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,217

$22.040

-

-

-

Microchip USA

USA . 437 parts In-Stock

1+ parts

$45.016

100+ parts

-

1k+ parts

-

10k+ parts

-

437

$45.016

-

-

-

Corphita

USA . 2,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,901

-

-

-

-

Perfect Parts

USA . 2,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,128

-

-

-

-

Parana Technologies

USA . 641 parts In-Stock

1+ parts

-

100+ parts

$7.267

1k+ parts

-

10k+ parts

-

641

-

$7.267

-

-

Overview

Elevate your designs with the VNS7NV04P-E from STMicroelectronics, a premier choice in peripheral drivers. Renowned for its robust quality and reliability, this compact solution excels in applications demanding precision and protection against transient, overcurrent, and thermal risks. With swift response times and a trusted manufacturer behind it, the VNS7NV04P-E ensures efficiency and performance, empowering you to innovate without compromise. Make the smart switch today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures reliability and sturdiness, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, facilitating modern compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility on circuit boards, enabling easier integration into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Integrated protection features enhance device longevity and reliability, safeguarding circuits against common electrical issues.

No. of Terminals: 8

With 8 terminals, this driver allows for versatile connections, suitable for diverse applications and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained environments, offering a compact solution without sacrificing performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent electrical conductivity and corrosion resistance, improving reliability over time.

Terminal Position: DUAL

Dual terminal positioning facilitates better layout and connection options on the PCB, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, fitting seamlessly into compact assemblies.

Width: 3.9 mm

The compact width of 3.9 mm allows for efficient use of board space, optimizing design density.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow time of 30 seconds is suitable for standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C accommodates most common solder types, providing compatibility with various production lines.

Length: 4.9 mm

The length of 4.9 mm supports compact designs while providing sufficient connectivity for peripheral driver applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering during assembly, improving manufacturability.

Turn-on Time: 2.3 us

A quick turn-on time of 2.3 microseconds ensures fast response in performance-critical applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB designs, making integration straightforward.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring appropriate handling and storage procedures to maintain quality.

Nominal Output Peak Current Limit: 9 A

A peak current limit of 9 A makes this driver capable of handling demanding loads, suitable for power-intensive applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of IC allows for versatile interfacing capabilities, making it ideal for a wide range of peripherals.

Turn-off Time: 16 us

The turn-off time of 16 microseconds supports efficient switching in dynamic applications, contributing to overall system performance.

Output Current Flow Direction: SINK

Having a sink output current flow direction allows for effective control of connected devices, enhancing the operational versatility of the driver.

Technical Specifications

Peripheral Drivers VNS7NV04P-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

16 us

Turn-on Time:

2.3 us

Width:

3.9 mm

Trade Compliance

VNS7NV04P-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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