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VNQ5E160AK-E

STMicroelectronics

VNQ5E160AK-E by STMicroelectronics

VNQ5E160AK-E by STMicroelectronics is a full bridge peripheral driver with a 24-terminal, rectangular package. It operates b/w 8-28V and supports up to 4 bits of driving capability. Ideal for applications requiring efficient power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,933 parts In-Stock

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7,933

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Digiode

USA . 2,665 parts In-Stock

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2,665

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Anansix

USA . 2,540 parts In-Stock

1+ parts

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2,540

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Cyclops Electronics Ltd

UK . 1,225 parts In-Stock

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1,225

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LIBRA Elektronik GmbH

Germany . 147 parts In-Stock

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147

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 290 parts In-Stock

1+ parts

$2.210

100+ parts

$2.030

1k+ parts

-

10k+ parts

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290

$2.210

$2.030

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IDEA Electronic Components Group

UK . 2,171 parts In-Stock

1+ parts

$6.871

100+ parts

-

1k+ parts

$6.184

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2,171

$6.871

-

$6.184

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MKK Technologies

India . 1,770 parts In-Stock

1+ parts

$12.920

100+ parts

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1,770

$12.920

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DigiPath Technology Company

USA . 1,770 parts In-Stock

1+ parts

$12.920

100+ parts

-

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1,770

$12.920

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$16.950

100+ parts

-

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206

$16.950

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Ampacity Inc.

Singapore . 1,145 parts In-Stock

1+ parts

$39.500

100+ parts

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1,145

$39.500

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QUARKTWIN TECHNOLOGY LTD

USA . 15,734 parts In-Stock

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15,734

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Perfect Parts

USA . 9,439 parts In-Stock

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9,439

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 5,856 parts In-Stock

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5,856

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Microchip USA

USA . 4,547 parts In-Stock

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4,547

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Corphita

USA . 3,721 parts In-Stock

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3,721

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Futuretech Components

Singapore . 2,446 parts In-Stock

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2,446

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Kepictronics

USA . 2,089 parts In-Stock

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2,089

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Parana Technologies

USA . 1,955 parts In-Stock

1+ parts

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100+ parts

$8.215

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1,955

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$8.215

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Overview

Unlock unparalleled performance with the VNQ5E160AK-E by STMicroelectronics, a trusted leader in innovative semiconductor solutions. This advanced peripheral driver delivers exceptional reliability and versatility across various applications, from automotive to industrial controls. With its robust design and efficient power management, enjoy seamless integration and enhanced operational efficiency. Choose quality and innovation—experience the advantages that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers good thermal and mechanical properties, ensuring reliability and longevity under various operating conditions.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automated assembly processes, reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, making it easier to integrate into compact designs.

Power Supplies (V): 8/28

Wide voltage range ensures compatibility with various power sources, making it versatile for different applications.

No. of Terminals: 24

A higher number of terminals facilitates more functionality and connections, which is ideal for complex peripheral applications.

Package Style (Meter): SMALL OUTLINE

The small outline design is suitable for space-constrained applications, allowing for higher density layouts.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and protection against oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on the PCB, facilitating easier integration into various designs.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for reliable soldering without damaging sensitive components during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with lead-free soldering processes, meeting modern environmental standards.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and improved soldering characteristics, enhancing reliability in operation.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for higher component density without compromising performance, suitable for compact devices.

Driver No. of Bits: 4

A 4-bit driver allows for a range of output options, enabling effective control over peripheral devices with various configurations.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the product is moderately sensitive to moisture, providing a balance between ease of handling and protection.

Interface IC Type: FULL BRIDGE BASED PERIPHERAL DRIVER

Full bridge configuration offers efficient control of motors and other peripherals, maximizing performance and reducing heat generation.

Output Current Flow Direction: SINK

Sink current flow is ideal for driving loads directly, simplifying the design and improving circuit performance.

Technical Specifications

Peripheral Drivers VNQ5E160AK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VNQ5E160AK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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