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VND5T016ASP-E

STMicroelectronics

VND5T016ASP-E by STMicroelectronics

VND5T016ASP-E by STMicroelectronics is a 16-terminal peripheral driver with power supplies ranging from 8V to 36V. It features a small outline package shape, gull wing terminal form, and 0.8mm terminal pitch. Ideal for applications requiring buffer or inverter-based interface ICs in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,706 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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3,706

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Digiode

USA . 3,457 parts In-Stock

1+ parts

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-

1k+ parts

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3,457

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Anansix

USA . 2,535 parts In-Stock

1+ parts

-

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2,535

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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68

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 534 parts In-Stock

1+ parts

$11.191

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$11.191

-

-

-

Aztec Data Supply Inc.

USA . 111 parts In-Stock

1+ parts

$12.200

100+ parts

-

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111

$12.200

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-

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

1+ parts

$13.367

100+ parts

-

1k+ parts

$12.030

10k+ parts

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1,696

$13.367

-

$12.030

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Semicontronic

India . 1,357 parts In-Stock

1+ parts

$14.500

100+ parts

$14.138

1k+ parts

$14.065

10k+ parts

-

1,357

$14.500

$14.138

$14.065

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$14.630

100+ parts

-

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647

$14.630

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MKK Technologies

India . 1,987 parts In-Stock

1+ parts

$25.135

100+ parts

-

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1,987

$25.135

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DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$25.135

100+ parts

-

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1,987

$25.135

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Ampacity Inc.

Singapore . 1,505 parts In-Stock

1+ parts

$36.500

100+ parts

-

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1,505

$36.500

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-

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Microchip USA

USA . 373 parts In-Stock

1+ parts

$85.339

100+ parts

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373

$85.339

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Lixinc

USA . 9,320 parts In-Stock

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9,320

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Argo Parts USA

USA . 4,554 parts In-Stock

1+ parts

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4,554

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Continental Prestige Electronics

USA . 4,388 parts In-Stock

1+ parts

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4,388

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Corphita

USA . 2,814 parts In-Stock

1+ parts

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2,814

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Parana Technologies

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

$15.982

1k+ parts

-

10k+ parts

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1,140

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$15.982

-

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Bastille Electronics

Australia . 75 parts In-Stock

1+ parts

-

100+ parts

-

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75

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Overview

Discover the exceptional quality and reliability of the VND5T016ASP-E by STMicroelectronics, a leading manufacturer in the industry. This peripheral driver offers unparalleled value with its wide range of applications and advanced features. With its robust design and innovative technology, this product provides customers with superior performance and efficiency. Trust STMicroelectronics to deliver cutting-edge solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and heat resistance, making this product suitable for various applications in different environments.

Surface Mount: YES

Surface mount capability allows for convenient and easy installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for neat placement on circuit boards, optimizing board layout.

Power Supplies (V): 8/36

Wide range of power supply voltage (8-36V) offers flexibility and compatibility with different power sources, enhancing versatility of the product.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components, enabling complex circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB, allowing for compact designs and efficient use of board real estate.

Terminal Position: DUAL

Dual terminal position offers redundancy and ensures reliable connections, reducing the risk of signal loss or disconnections.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and enhances solder joint reliability, contributing to overall product durability.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting, enabling integration of multiple drivers in a limited space without sacrificing performance.

Driver No. of Bits: 2

Having 2 bits allows for simple but effective signal processing and control, suitable for various peripheral driver applications that do not require extensive data manipulation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter-based interface IC type ensures compatibility with a wide range of input/output signals, making this product versatile and adaptable to different system configurations.

Technical Specifications

Peripheral Drivers VND5T016ASP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G18

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.55,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

VND5T016ASP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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