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VND5E160J-E

STMicroelectronics

VND5E160J-E by STMicroelectronics

VND5E160J-E by STMicroelectronics is a half-bridge peripheral driver with a 12-terminal, small outline package. It operates at power supplies of 8/28V and supports output currents with a max peak reflow temp of 260 °C. Ideal for automotive and industrial applications, it features CMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,822 parts In-Stock

1+ parts

-

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2,822

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Vyrian

USA . 2,719 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,719

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-

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Digiode

USA . 1,729 parts In-Stock

1+ parts

-

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1,729

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ComSIT Distribution GmbH

Germany . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 345 parts In-Stock

1+ parts

$2.956

100+ parts

-

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345

$2.956

-

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$10.517

100+ parts

-

1k+ parts

$9.466

10k+ parts

-

2,322

$10.517

-

$9.466

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AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$16.120

100+ parts

-

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215

$16.120

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-

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MKK Technologies

India . 106 parts In-Stock

1+ parts

$19.777

100+ parts

-

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106

$19.777

-

-

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DigiPath Technology Company

USA . 106 parts In-Stock

1+ parts

$19.777

100+ parts

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10k+ parts

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106

$19.777

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Component Stockers USA

USA . 660 parts In-Stock

1+ parts

$99.990

100+ parts

-

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660

$99.990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 2,912 parts In-Stock

1+ parts

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2,912

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Corphita

USA . 1,580 parts In-Stock

1+ parts

-

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1,580

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Parana Technologies

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$12.575

1k+ parts

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10k+ parts

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540

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$12.575

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iodParts Technologies Inc.

India . 400 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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400

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Overview

Elevate your projects with the VND5E160J-E from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile peripheral driver excels in performance and reliability, perfect for automotive and industrial applications. With its compact design and robust features, it ensures seamless integration into your systems, allowing for efficient power management. Trust in STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environmental conditions, making this product a dependable choice for peripheral applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, facilitating compact designs and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility, accommodating various design requirements and enhancing integration into different systems.

Power Supplies: 8/28 V

The wide voltage range (8-28V) provides versatility, allowing this driver to be used in various applications with different power requirements.

No. of Terminals: 12

With 12 terminals, this product allows for multiple connections and enhanced functionality, making it suitable for complex applications.

Package Style: SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, enabling integration into compact electronic devices.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish ensures good solderability and corrosion resistance, contributing to the overall reliability of the connections.

Terminal Position: DUAL

The dual terminal position design facilitates easier layout management on the PCB, enhancing circuit design flexibility.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature of 260 °C indicates robustness against soldering processes, ensuring reliable assembly.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high-speed operation, making this driver efficient for various applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves stability and reliability on the PCB.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density mounting on PCBs, making it suitable for modern electronic designs.

Driver No. of Bits: 2

A 2-bit driver allows for sufficient control in peripheral applications, contributing to precise operations in a compact format.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand a moderate level of humidity exposure, making it robust for various operational environments.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge configuration is effective for driving loads, providing a versatile solution for controlling motors and other devices in peripherals.

Output Current Flow Direction: SINK

The ability to sink output current makes this driver suitable for various applications, providing flexibility in load management.

Technical Specifications

Peripheral Drivers VND5E160J-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

12

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5E160J-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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