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VND5E050J-E

STMicroelectronics

VND5E050J-E by STMicroelectronics

VND5E050J-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and supports output currents up to 2A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,492

-

-

-

-

Digiode

USA . 3,027 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,027

-

-

-

-

Anansix

USA . 2,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,675

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 228 parts In-Stock

1+ parts

$5.555

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$5.555

-

-

-

IDEA Electronic Components Group

UK . 83 parts In-Stock

1+ parts

$7.499

100+ parts

-

1k+ parts

$6.749

10k+ parts

-

83

$7.499

-

$6.749

-

AZTECH Wire

Italy . 788 parts In-Stock

1+ parts

$13.350

100+ parts

-

1k+ parts

-

10k+ parts

-

788

$13.350

-

-

-

MKK Technologies

India . 1,363 parts In-Stock

1+ parts

$14.101

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

$14.101

-

-

-

DigiPath Technology Company

USA . 1,363 parts In-Stock

1+ parts

$14.101

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

$14.101

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,075 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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25,075

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-

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Metaverse IC Inc.

Canada . 3,264 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,264

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-

-

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Corphita

USA . 2,586 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,586

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-

-

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Parana Technologies

USA . 74 parts In-Stock

1+ parts

-

100+ parts

$8.966

1k+ parts

-

10k+ parts

-

74

-

$8.966

-

-

Overview

Experience unparalleled reliability and performance with the VND5E050J-E from STMicroelectronics, a leader in cutting-edge technology. This compact peripheral driver excels in diverse applications, offering robust built-in protections against overcurrent, voltage spikes, and thermal issues. With its high-efficiency design, it ensures optimal power management, giving you peace of mind while enhancing your projects' longevity and efficiency. Elevate your solutions with unmatched quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuits, saving space and improving assembly efficiency.

Maximum Supply Voltage: 28 V

With a maximum supply voltage of 28V, this driver is versatile for a wide range of applications, ensuring compatibility with high-voltage systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and design in circuit boards, optimizing space utilization.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The extensive built-in protection mechanisms enhance reliability, safeguarding the driver from various electrical stresses.

Power Supplies (V): 8/28

Support for a wide range of power supplies (8V to 28V) increases the product's flexibility in different electrical environments.

No. of Terminals: 12

Having 12 terminals allows for multiple connections, improving functionality and simplifying installation in complex systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This package style contributes to a compact design that can improve thermal performance and save board space.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V enables operation in low-voltage scenarios, making it suitable for battery-powered and energy-efficient applications.

Terminal Position: DUAL

The dual terminal position enhances the adaptability of the product, accommodating various circuit designs.

Maximum Seated Height: 1.62 mm

A low seated height of 1.62 mm is advantageous for applications where space is limited, thus enabling sleek designs.

Width: 3.9 mm

The compact width of 3.9 mm contributes to space-saving layouts on circuit boards, essential for modern electronic devices.

Length: 4.9 mm

Short length allows for close placement to other components, minimizing layout area and enhancing circuit performance.

Maximum Output Current: 2 A

The ability to support up to 2 A output current makes this driver suitable for driving various peripheral devices effectively.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical support and soldering ease, ensuring a robust connection in the final assembly.

Nominal Supply Voltage: 13 V

Operating optimally at a nominal supply voltage of 13V, this driver is ideal for many standard applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density designs, making it easier to fit more drivers on compact boards.

Driver No. of Bits: 2

Having 2 bits allows for efficient control over peripheral devices, making it suitable for applications requiring simple digital signals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The IC type enables versatile applications, effectively buffering or inverting signals as needed in varied interface scenarios.

Output Current Flow Direction: SOURCE

Source output current capability allows for straightforward integration into many designs, ensuring reliable operation of connected devices.

Technical Specifications

Peripheral Drivers VND5E050J-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

VND5E050J-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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