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VN5770AKTR-E

STMicroelectronics

VN5770AKTR-E by STMicroelectronics

VN5770AKTR-E by STMicroelectronics is a half-bridge peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact SO package with 28 terminals. Ideal for automotive applications requiring robust control of motors or actuators.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,852 parts In-Stock

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5,852

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Digiode

USA . 1,276 parts In-Stock

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1,276

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Anansix

USA . 358 parts In-Stock

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358

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$2.089

100+ parts

-

1k+ parts

$1.880

10k+ parts

-

1,985

$2.089

-

$1.880

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MKK Technologies

India . 1,849 parts In-Stock

1+ parts

$3.929

100+ parts

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1,849

$3.929

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DigiPath Technology Company

USA . 1,849 parts In-Stock

1+ parts

$3.929

100+ parts

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1,849

$3.929

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AZTECH Wire

Italy . 1,135 parts In-Stock

1+ parts

$15.250

100+ parts

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1,135

$15.250

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A-Z Elektronik GmbH

Germany . 5,682 parts In-Stock

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5,682

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Microchip USA

USA . 4,738 parts In-Stock

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4,738

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Corphita

USA . 2,665 parts In-Stock

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2,665

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Parana Technologies

USA . 223 parts In-Stock

1+ parts

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$2.498

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223

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$2.498

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Overview

Elevate your designs with the VN5770AKTR-E from STMicroelectronics, a pinnacle of reliability in peripheral drivers. Crafted with advanced built-in protections against overcurrent, voltage spikes, and thermal issues, this component ensures robust performance in demanding applications. Experience seamless integration, superior efficiency, and compact design that enhance your projects while maximizing value. Trust STMicroelectronics for quality that powers innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures longevity and reliable operation in various environments.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern PCB layouts.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can be utilized in a wide range of applications requiring robust power handling.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards, making it suitable for tight layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and safeguard against common electrical faults, ensuring longevity.

No. of Terminals: 28

The 28 terminals provide versatile connectivity options for complex applications needing multiple connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact footprint, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage expands compatibility with various power supply configurations, increasing versatility.

Terminal Position: DUAL

Dual terminal positioning supports a variety of layout designs and simplifies the process of integrating into existing boards.

Maximum Seated Height: 2.65 mm

A low profile design ensures this device can fit beneath heat sinks and other components, reducing height requirements.

Width: 7.5 mm

The compact width makes it suitable for high-density board layouts, enhancing design flexibility.

Length: 17.9 mm

The moderate length is balanced, offering a good trade-off between power handling and board layout simplicity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability when mounted to a PCB.

Nominal Supply Voltage: 13 V

Operating around a nominal supply voltage of 13 V provides a stable performance range for most applications.

Turn-on Time: 300 us

A relatively fast turn-on time allows for quick response in applications that depend on rapid switching.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB design and promotes compatibility with existing layouts.

Nominal Output Peak Current Limit: 12 A

The ability to handle nominal output peak currents of 12 A makes this driver suitable for high-power loads.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Being a half bridge based driver makes it ideal for driving inductive loads such as motors, enhancing control capability.

Turn-off Time: 250 us

A quick turn-off time enables effective control in fast-switching applications, minimizing energy loss.

Output Current Flow Direction: SOURCE

With a source current flow direction, this driver is versatile for various applications requiring controlled power delivery.

Technical Specifications

Peripheral Drivers VN5770AKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

12 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

250 us

Turn-on Time:

300 us

Width:

7.5 mm

Trade Compliance

VN5770AKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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