Loading...

VN03(011Y)

STMicroelectronics

VN03(011Y) by STMicroelectronics

VN03(011Y) by STMicroelectronics is a robust peripheral driver designed for automotive applications, operating b/w -40 °C and 125 °C. It supports a max supply voltage of 26V and features built-in protections against transient, overcurrent, and thermal issues. With a nominal output peak current limit of 0.9A, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

-

-

-

-

Digiode

USA . 1,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,587

-

-

-

-

Anansix

USA . 923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

923

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 299 parts In-Stock

1+ parts

$2.378

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$2.378

-

-

-

IDEA Electronic Components Group

UK . 700 parts In-Stock

1+ parts

$11.690

100+ parts

-

1k+ parts

$10.521

10k+ parts

-

700

$11.690

-

$10.521

-

MKK Technologies

India . 2,079 parts In-Stock

1+ parts

$21.983

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$21.983

-

-

-

DigiPath Technology Company

USA . 2,079 parts In-Stock

1+ parts

$21.983

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$21.983

-

-

-

Component Stockers USA

USA . 757 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

757

$99.990

-

-

-

Corphita

USA . 1,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

-

-

-

-

Parana Technologies

USA . 464 parts In-Stock

1+ parts

-

100+ parts

$13.978

1k+ parts

-

10k+ parts

-

464

-

$13.978

-

-

Overview

Elevate your projects with the VN03(011Y) from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for robust performance, this automotive-grade peripheral driver ensures reliability with built-in protections against transients, overcurrent, and thermal faults. Whether you're automating vehicles or enhancing industrial systems, enjoy peace of mind knowing your applications are backed by exceptional quality and support from a globally recognized manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and protection against environmental factors, making it suitable for diverse applications.

Maximum Supply Voltage: 26 V

A high maximum supply voltage allows for flexibility in various system designs, accommodating a wide range of power requirements.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization in PCB layouts, making it easier to integrate into compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance the safety and longevity of the product by preventing damage under various fault conditions.

No. of Terminals: 5

The 5 terminal configuration enables a simple yet versatile connection setup, suitable for various application needs.

Package Style (Meter): FLANGE MOUNT

Flange mount installation ensures secure and stable positioning in your device, reducing the risk of movement and damage.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage requirement of 5.5 V supports a range of input power sources, making it adaptable for different operational scenarios.

Maximum Operating Temperature: 125 °C

Operating at high temperatures up to 125 °C ensures this peripheral driver can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range, from -40 °C, means adaptability for use in harsh conditions, including extreme cold.

Terminal Finish: MATTE TIN

Matte tin terminal finish helps reduce oxidation and improves solderability, facilitating reliable electrical connections.

Terminal Position: ZIG-ZAG

The zig-zag terminal configuration allows for efficient routing on PCBs, optimizing space and reducing signal interference.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade assures robust performance in vehicles, offering enhanced reliability in automotive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides strong mechanical support and soldering stability, making it ideal for various mounting options.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V is optimal for many peripheral devices, ensuring efficient operation within this voltage peak.

Nominal Output Peak Current Limit: 0.9 A

A 0.9 A peak current limit allows for good performance in driving devices without risking overload or damage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This product's flexible interface IC type ensures compatibility with a variety of control systems and data processing applications.

Output Current Flow Direction: SOURCE

The output current source configuration allows the peripheral driver to provide necessary power to connected devices effectively.

Technical Specifications

Peripheral Drivers VN03(011Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T5

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

VN03(011Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7