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TSV850ILT

STMicroelectronics

TSV850ILT by STMicroelectronics

TSV850ILT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 6000 uV and nominal unity gain bandwidth of 1300 kHz. Ideal for automotive applications, this CMOS technology op amp features low bias current (0.06 uA @25C) and operates in a wide temperature range (-40 to 125 °C).

Median Price

$0.378

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$0.378

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3,000

$0.378

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$0.378

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-

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3,000

-

$0.378

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Chip1Stop

Japan . 2,887 parts In-Stock

1+ parts

-

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2,887

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Distributors (In-Stock)

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Digiode

USA . 2,401 parts In-Stock

1+ parts

$0.286

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-

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2,401

$0.286

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.328

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100

$0.328

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Vyrian

USA . 6,786 parts In-Stock

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6,786

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Anansix

USA . 1,219 parts In-Stock

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1,219

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,183 parts In-Stock

1+ parts

$0.256

100+ parts

-

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2,183

$0.256

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Corphita

USA . 303 parts In-Stock

1+ parts

$0.271

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303

$0.271

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.328

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1,000

$0.328

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$0.920

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5,000

$0.920

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IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$2.708

100+ parts

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$2.438

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564

$2.708

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$2.438

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MKK Technologies

India . 325 parts In-Stock

1+ parts

$5.093

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325

$5.093

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DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

$5.093

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325

$5.093

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Microchip USA

USA . 5,334 parts In-Stock

1+ parts

$5.475

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5,334

$5.475

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AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$11.260

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338

$11.260

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Parana Technologies

USA . 814 parts In-Stock

1+ parts

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$3.238

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814

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$3.238

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Overview

Discover the superior performance and reliability of the TSV850ILT operational amplifier by STMicroelectronics. With a wide range of applications in automotive and industrial settings, this high-quality product offers exceptional value and benefits to customers. Experience unparalleled precision and efficiency with the TSV850ILT, designed to meet the demands of modern technology. Trust in the expertise of STMicroelectronics, a reputable manufacturer known for delivering cutting-edge solutions that exceed expectations. Elevate your projects with the TSV850ILT and unlock new possibilities in amplification and signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and cost-effective.

Maximum Input Offset Voltage: 6000 uV

The low maximum input offset voltage ensures accurate signal processing in critical applications.

Maximum Average Bias Current (IIB): 0.11 uA

The low bias current minimizes power consumption and enhances overall efficiency.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

The rectangular package shape is versatile and fits well in various circuit layouts.

Nominal Common Mode Reject Ratio: 75 dB

The high common mode reject ratio reduces unwanted noise interference for clean signals.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage is ideal for low-power applications and battery-operated devices.

Power Supplies (V): 2.7/5

Compatibility with multiple power supply voltages provides flexibility in different system setups.

No. of Terminals: 6

The six terminals offer connectivity options for diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile package style saves space and is suitable for compact designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV850ILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

2.7/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

110 nA

Maximum Bias Current (IIB) @25 °C:

60 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

180 μA

Physical Characteristics

Length:

0.115 in (2.925 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

TSV850ILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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