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TSV6395AIPT

STMicroelectronics

TSV6395AIPT by STMicroelectronics

TSV6395AIPT from STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 2000 µV and a nominal voltage of 1.8V. It features four functions in a compact 16-terminal package, ideal for automotive applications. With a CMRR of 74 dB and low bias current, it ensures high precision in signal processing.

Median Price

$0.712

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 2,500 parts In-Stock

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$0.700

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$0.700

DigiKey

USA . 2,253 parts In-Stock

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$0.725

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$0.725

Distributors (In-Stock)

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Vyrian

USA . 8,569 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,249 parts In-Stock

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Bristol Electronics

USA . 2,249 parts In-Stock

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$1.087

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$0.609

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$0.574

2,249

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$1.087

$0.609

$0.574

Dan-Mar Components

USA . 2,249 parts In-Stock

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2,249

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Digiode

USA . 1,281 parts In-Stock

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Anansix

USA . 772 parts In-Stock

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Vigor

Singapore . 5,244 parts In-Stock

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$1.710

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$1.710

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Microchip USA

USA . 417 parts In-Stock

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$2.461

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417

$2.461

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IDEA Electronic Components Group

UK . 1,452 parts In-Stock

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$4.287

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$3.858

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$4.287

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$3.858

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MKK Technologies

India . 1,543 parts In-Stock

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$8.062

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DigiPath Technology Company

USA . 1,543 parts In-Stock

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$8.062

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$8.062

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AZTECH Wire

Italy . 1,081 parts In-Stock

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$19.750

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QUARKTWIN TECHNOLOGY LTD

USA . 25,076 parts In-Stock

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Perfect Parts

USA . 5,495 parts In-Stock

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Corphita

USA . 2,896 parts In-Stock

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Component Stockers USA

USA . 2,342 parts In-Stock

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Parana Technologies

USA . 2,106 parts In-Stock

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$5.126

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$5.126

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Overview

Unlock exceptional performance with the TSV6395AIPT operational amplifier from STMicroelectronics. Renowned for superior quality and reliability, this compact solution excels in demanding applications, delivering precision with ultra-low power consumption. Its robust design ensures seamless integration in automotive systems, medical devices, and consumer electronics, providing unmatched value that empowers your projects to thrive. Experience innovation you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 2000 uV

A low input offset voltage ensures precise control and accuracy in applications, enhancing overall performance.

Maximum Average Bias Current (IIB): 0.000001 uA

Minimally invasive current draw allows for efficient power management, making it ideal for battery-powered and low-power applications.

Surface Mount: YES

Having a surface mount option allows for compact designs and easy integration into modern PCBs.

No. of Functions: 4

Multiple functions in one package offer versatility and reduce the need for additional components in a design.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout on PCBs and optimized use of space.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio enhances signal integrity by reducing noise, making it suitable for sensitive applications.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage improves compatibility with modern low-power electronics.

Power Supplies (V): 1.8/5

Dual power supply options add flexibility to system design and integration into various applications.

No. of Terminals: 16

A good number of terminals allows for multiple interfacing and configurability in designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are advantageous for space-constrained applications, while the shrink pitch is optimized for modern manufacturing.

Maximum Supply Voltage Limit: 6 V

A higher supply voltage limit provides more headroom for varied application needs while ensuring reliable operation.

Maximum Operating Temperature: 125 °C

A high operating temperature allows this op-amp to be used in automotive and industrial applications where heat is a concern.

Maximum Bias Current (IIB) @25 °C: 0.00001 uA

Very low bias current at a standard temperature enhances accuracy and thermal stability in precision applications.

Frequency Compensation: YES

Built-in frequency compensation simplifies design and improves stability in feedback applications.

Minimum Voltage Gain: 10000

A high minimum voltage gain is essential for amplifying weak signals in various electronic circuits.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures makes this component suitable for harsh environments and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

A high-quality terminal finish increases reliability over time and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positions facilitate flexible connectivity options in various circuit layouts.

Maximum Seated Height: 1.2 mm

Low seated height allows for use in ultra-thin devices or applications with strict space constraints.

Width: 4.4 mm

Compact width enables it to be easily integrated into space-limited designs without compromising functionality.

Micropower: YES

Micropower technology is ideal for energy-efficient designs, extending battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 40

This characteristic allows it to withstand the reflow soldering process, suitable for high-volume manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature is crucial for compatibility with modern soldering processes and materials.

Length: 5 mm

The compact length contributes to a smaller overall footprint on PCBs, enabling dense design layouts.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures this component meets the rigorous reliability and performance expectations for automotive applications.

Low-Bias: YES

Low bias characteristics enhance measurement accuracy, making it ideal for instrumentation applications.

Nominal Unity Gain Bandwidth: 2000 kHz

A high unity gain bandwidth allows for high-speed operation in communication and signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, crucial for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and mounting characteristics, enhancing mechanical stability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components widely used in various applications, ensuring broad compatibility for designers.

Maximum Supply Current: 0.288 mA

Low supply current consumption promotes energy efficiency in battery-operated and low-power devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is ideal for a wide range of applications, offering flexibility in design.

Packing Method: TAPE AND REEL

Tape and reel packaging is suitable for automated assembly processes, improving manufacturing efficiency.

Nominal Slow Rate: 0.7 V/us

A moderate slew rate assures reliable performance in various applications, balancing speed and stability.

Terminal Pitch: 0.65 mm

The terminal pitch is optimized for high-density mounting, supporting space-effective PCB designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates reasonable handling precautions, ensuring reliability in humid environments.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6395AIPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.7 V/us

Peak Bias Current:

1 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

288 μA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP16,.25

Trade Compliance

TSV6395AIPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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