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TSV6392ILT

STMicroelectronics

TSV6392ILT by STMicroelectronics

TSV6392ILT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 4500 µV, a nominal voltage of 1.8 V, and operates at temperatures from -40 °C to 125°C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 3,000 parts In-Stock

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$0.430

3,000

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$0.430

Distributors (In-Stock)

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Vyrian

USA . 7,084 parts In-Stock

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7,084

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Anansix

USA . 2,094 parts In-Stock

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2,094

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Digiode

USA . 539 parts In-Stock

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539

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Distributors (Availability)

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Semicontronic

India . 2,977 parts In-Stock

1+ parts

$0.383

100+ parts

$0.373

1k+ parts

$0.372

10k+ parts

-

2,977

$0.383

$0.373

$0.372

-

Microchip USA

USA . 315 parts In-Stock

1+ parts

$3.082

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-

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315

$3.082

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IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$4.209

100+ parts

-

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$3.788

10k+ parts

-

1,842

$4.209

-

$3.788

-

MKK Technologies

India . 404 parts In-Stock

1+ parts

$7.915

100+ parts

-

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404

$7.915

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DigiPath Technology Company

USA . 404 parts In-Stock

1+ parts

$7.915

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404

$7.915

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AZTECH Wire

Italy . 952 parts In-Stock

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$9.390

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952

$9.390

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,157 parts In-Stock

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Perfect Parts

USA . 7,213 parts In-Stock

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Vigor

Singapore . 7,113 parts In-Stock

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Component Stockers USA

USA . 4,057 parts In-Stock

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4,057

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Parana Technologies

USA . 2,229 parts In-Stock

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$5.032

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2,229

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$5.032

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Corphita

USA . 1,573 parts In-Stock

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1,573

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Overview

Elevate your designs with the TSV6392ILT operational amplifier from STMicroelectronics, a trusted leader in semiconductor innovation. This micropower, dual-function Op Amp excels in precision applications, offering exceptional performance in automotive and battery-operated devices. With low bias currents and impressive common-mode rejection, it ensures reliability and efficiency. Unlock unparalleled value in your projects while benefiting from STMicroelectronics' commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resilience in various environments, making it suitable for automotive applications.

Maximum Input Offset Voltage: 4500 uV

This low offset voltage contributes to high accuracy in amplifying signals, making it ideal for precision applications.

Maximum Average Bias Current (IIB): 0.000001 uA

The ultra-low bias current reduces the impact on signal integrity, ensuring high performance in sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

No. of Functions: 2

Dual-function capability increases versatility, allowing for multiple applications within a single component.

Package Shape: RECTANGULAR

The rectangular shape provides a larger surface for soldering, improving mechanical stability in the circuit.

Nominal Common Mode Reject Ratio: 74 dB

A high CMRR indicates excellent rejection of common-mode signals, enhancing the quality of the amplified output.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a lower supply voltage enhances energy efficiency, important for battery-powered applications.

Power Supplies (V): 1.8/5

Flexibility in supply voltage allows for a wider range of applications without compromising performance.

No. of Terminals: 8

The eight terminals provide multiple connectivity options, facilitating easier integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile design is perfect for space-constrained designs, commonly found in automotive electronics.

Maximum Supply Voltage Limit: 6 V

The maximum voltage limit provides sufficient headroom for various applications while ensuring safe operation.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes it reliable for automotive and industrial environments where heat is a concern.

Maximum Bias Current (IIB) @ 25 °C: 0.00001 uA

This very low bias current at room temperature ensures minimal signal distortion, enhancing accuracy in applications.

Frequency Compensation: YES

On-chip frequency compensation simplifies design, enhancing stability and bandwidth in feedback applications.

Minimum Voltage Gain: 10000

A high minimum gain allows for significant amplification of weak signals, making this op-amp suited for sensitive applications.

Minimum Operating Temperature: -40 °C

Operating at extremely low temperatures ensures performance in harsh environments like automotive and aerospace.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and reduces the risk of oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility in printed circuit board (PCB) design.

Maximum Seated Height: 1.45 mm

Low seated height allows for compact assembly in space-restricted designs without compromising on performance.

Width: 1.625 mm

The narrow width aids in high-density circuit board designs, perfect for modern electronic applications.

Micropower: YES

Micropower consumption makes this op-amp ideal for low-power applications, which is crucial for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

Time flexibility during soldering process assists in achieving reliable solder joints and minimizes component stress.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates good thermal stability, ensuring reliable performance even in challenging conditions.

Length: 2.9 mm

Compact length supports space-saving designs, an essential factor in today's highly integrated electronic systems.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive use, ensuring reliability and performance under fluctuating temperature conditions.

Low-Bias: YES

Low-bias performance optimizes accuracy, making this op-amp suitable for precision measurement applications.

Nominal Unity Gain Bandwidth: 2000 kHz

A high gain bandwidth product ensures versatile application in high-speed signal processing scenarios.

Technology: CMOS

CMOS technology provides low power consumption and high performance, ideal for portable and battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals provide excellent mechanical strength and are well-suited for automated assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are fundamental components in signal conditioning and processing, making this device versatile.

Maximum Supply Current: 0.144 mA

Low supply current helps in minimizing power consumption, perfect for low-power and battery-operated applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture enhances performance in linear applications, ensuring better signal fidelity.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates easy handling and placement during automated assembly processes.

Nominal Slew Rate: 0.7 V/us

A nominal slew rate indicates suitable responsiveness for dynamic signals, making it ideal for audio and communication systems.

Terminal Pitch: 0.65 mm

The standard terminal pitch allows for compatibility with existing designs, simplifying the integration process.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6392ILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.7 V/us

Peak Bias Current:

1 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

144 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.1

Trade Compliance

TSV6392ILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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