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TSV6390AILT

STMicroelectronics

TSV6390AILT by STMicroelectronics

TSV6390AILT from STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 2000 µV, low bias current of 0.1 nA, and operates within a supply range of 1.8-5 V. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,696 parts In-Stock

1+ parts

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8,696

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Anansix

USA . 1,744 parts In-Stock

1+ parts

-

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1k+ parts

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1,744

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Digiode

USA . 450 parts In-Stock

1+ parts

-

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$0.500

-

-

-

Andel Nordic

Denmark . 4,894 parts In-Stock

1+ parts

$3.170

100+ parts

-

1k+ parts

$3.043

10k+ parts

$3.043

4,894

$3.170

-

$3.043

$3.043

Microchip USA

USA . 4,079 parts In-Stock

1+ parts

$4.102

100+ parts

-

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10k+ parts

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4,079

$4.102

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IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$4.815

100+ parts

-

1k+ parts

$4.334

10k+ parts

-

1,188

$4.815

-

$4.334

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$8.360

100+ parts

-

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448

$8.360

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MKK Technologies

India . 1,241 parts In-Stock

1+ parts

$9.055

100+ parts

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1,241

$9.055

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DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$9.055

100+ parts

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1,241

$9.055

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Kepictronics

USA . 30,000 parts In-Stock

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30,000

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A-Z Elektronik GmbH

Germany . 5,570 parts In-Stock

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5,570

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Corphita

USA . 2,813 parts In-Stock

1+ parts

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2,813

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Perfect Parts

USA . 2,541 parts In-Stock

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2,541

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Parana Technologies

USA . 2,085 parts In-Stock

1+ parts

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100+ parts

$5.757

1k+ parts

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2,085

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$5.757

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Overview

Experience unparalleled precision and reliability with the TSV6390AILT operational amplifier from STMicroelectronics. Renowned for its exceptional quality and innovation, STMicroelectronics delivers a product that excels in automotive applications, ensuring optimal performance even in extreme conditions. With low power consumption and impressive common mode rejection, the TSV6390AILT enhances efficiency while minimizing noise. Elevate your designs and trust in ST's commitment to excellence for sustainable success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this Op Amp suitable for various applications.

Maximum Input Offset Voltage: 2000 uV

A low input offset voltage enhances precision and accuracy in signal processing, which is crucial for high-performance applications.

Maximum Average Bias Current (IIB): 0.0001 uA

This low bias current contributes to lower power consumption and improved battery life in portable applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, beneficial for high-density PCBs.

Package Shape: RECTANGULAR

The rectangular shape offers efficient board space utilization and facilitates easy layout in electronic designs.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode rejection ratio minimizes the effects of noise, enhancing signal integrity in differential applications.

Nominal Supply Voltage / Vsup (V): 1.8

This low supply voltage is ideal for low-power applications, contributing to energy efficiency.

Power Supplies (V): 1.8/5

Dual supply range allows for flexibility in various circuit configurations, accommodating diverse operating conditions.

No. of Terminals: 6

A compact footprint with 6 terminals is suitable for space-constrained designs while maintaining functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style allows for low-profile designs, making it compatible with advanced compact electronic systems.

Maximum Supply Voltage Limit: 6 V

The high voltage limit allows this Op Amp to be used in various applications without risk of damage from voltage spikes.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability in automotive and industrial applications where thermal extremes may occur.

Frequency Compensation: YES

Built-in frequency compensation allows stable operation across various frequencies, enhancing performance in diverse applications.

Minimum Voltage Gain: 10000

A minimum voltage gain of 10,000 indicates strong amplification capabilities, suitable for weak signal processing.

Minimum Operating Temperature: -40 °C

Extended temperature range ensures reliable operation in harsh environments, making it ideal for automotive uses.

Terminal Finish: NICKEL PALLADIUM GOLD

The robust terminal finish enhances solderability and provides long-term reliability in electronic connections.

Terminal Position: DUAL

Dual terminal position facilitates efficient integration into multiple circuit designs.

Maximum Seated Height: 1.45 mm

A low maximum seated height enables the design of slim electronic devices without compromising performance.

Width: 1.625 mm

Narrow width contributes to compact PCB designs, essential for modern electronics.

Micropower: YES

Micropower operation is advantageous for energy-sensitive applications, extending battery life in portable electronics.

Maximum Time At Peak Reflow Temperature (s): 30

This specification is important for ensuring reliable solder connections during the manufacturing process.

Peak Reflow Temperature °C: 260

A high reflow temperature ensures compatibility with standard soldering techniques, critical for mass production.

Length: 2.925 mm

Short length allows for compact placements on PCBs, aiding in the miniaturization of electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and performance in vehicles operating under variable conditions.

Low-Bias: YES

Low-bias characteristics improve accuracy and efficiency, making this Op Amp suitable for high-precision applications.

Nominal Unity Gain Bandwidth: 2000 kHz

High gain bandwidth facilitates performance in high-frequency applications, offering versatility in various signal types.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals are standard for surface mount devices, ensuring easy handling and placement during manufacturing.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this component is versatile and widely used in numerous electronic circuits.

Maximum Supply Current: 0.072 mA

Low supply current enhances power efficiency, making the Op Amp suitable for battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides stability and versatility, accommodating various feedback configurations.

Packing Method: TAPE AND REEL

Tape and reel packing is ideal for automated assembly, facilitating mass production and efficiency.

Nominal Slow Rate: 0.7 V/us

A moderate slow rate adds stability to signal transitions, desirable in applications needing controlled response times.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm strikes a balance between density and manufacturability, suitable for high-performance PCBs.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6390AILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

10000

Nominal Slew Rate:

0.7 V/us

Peak Bias Current:

100 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

72 μA

Physical Characteristics

Length:

0.115 in (2.925 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSSOP6,.08

Trade Compliance

TSV6390AILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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