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TSV632AILT

STMicroelectronics

TSV632AILT by STMicroelectronics

TSV632AILT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 2000 µV and low bias current of just 0.0001 µA. It operates on supply voltages from 1.8V to 5V, making it ideal for automotive applications. Its compact design features an 8-terminal gull-wing package, ensuring efficient space utilization in circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,013 parts In-Stock

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7,013

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Digiode

USA . 3,613 parts In-Stock

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3,613

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Anansix

USA . 1,951 parts In-Stock

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1,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 161 parts In-Stock

1+ parts

$2.633

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161

$2.633

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IDEA Electronic Components Group

UK . 1,646 parts In-Stock

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$6.203

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-

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$5.582

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1,646

$6.203

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$5.582

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MKK Technologies

India . 997 parts In-Stock

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$11.664

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997

$11.664

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DigiPath Technology Company

USA . 997 parts In-Stock

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$11.664

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997

$11.664

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AZTECH Wire

Italy . 597 parts In-Stock

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$18.520

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597

$18.520

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,309 parts In-Stock

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Perfect Parts

USA . 2,040 parts In-Stock

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Parana Technologies

USA . 1,399 parts In-Stock

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$7.416

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1,399

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$7.416

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Overview

Elevate your designs with the TSV632AILT from STMicroelectronics, a trusted leader in innovation. This dual operational amplifier combines ultra-low bias currents and impressive common-mode rejection for precision performance in automotive and industrial applications. Its compact, low-profile design ensures seamless integration, while its robust temperature range guarantees reliability. Experience enhanced efficiency and exceptional quality—choose TSV632AILT for superior results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 2000 uV

A low maximum input offset voltage enhances precision and accuracy in applications that require high fidelity signal processing.

Maximum Average Bias Current (IIB): 0.0001 uA

A very low average bias current is essential for battery-operated and power-sensitive applications, extending battery life.

Surface Mount: YES

The surface mount design facilitates easier integration into compact electronic circuits, making assembly processes more efficient.

No. of Functions: 2

Having two functions allows for versatile configurations in various signal processing tasks, enhancing the chip's utility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and makes it easier to lay out components in electronic designs.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio ensures that the op-amp can effectively differentiate between common noise and the actual signal, improving overall signal integrity.

Nominal Supply Voltage / Vsup (V): 1.8

A low supply voltage makes the op-amp suitable for low-power applications, contributing to energy efficiency.

Power Supplies (V): 1.8/5

The dual supply range allows for flexibility in design, accommodating various circuit requirements without needing multiple components.

No. of Terminals: 8

The 8-terminal configuration balances functional complexity and space efficiency, enabling compact designs without sacrificing capabilities.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style is ideal for space-constrained applications, allowing for high-density PCBs.

Minimum Slew Rate: 0.2 V/us

While modest, the slew rate is sufficient for many standard applications where rapid signal changes are not critical.

Maximum Supply Voltage Limit: 6 V

The supply voltage limit provides necessary safety margins to protect the op-amp under varied operating conditions.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliability and performance in demanding environments, especially for automotive applications.

Maximum Bias Current (IIB) @ 25C: 0.00001 uA

This extremely low bias current contributes to minimal signal distortion, crucial for high-precision applications.

Frequency Compensation: YES

Built-in frequency compensation enhances stability and performance across a range of frequencies, simplifying design considerations.

Minimum Voltage Gain: 10000

A high voltage gain allows the op-amp to amplify weak signals effectively, making it ideal for sensor applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the op-amp to function reliably in harsh environments where temperatures can fluctuate significantly.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and prevents oxidation, enhancing reliability in connections.

Terminal Position: DUAL

The dual terminal position can facilitate easier routing in PCB layouts, enhancing design flexibility.

Maximum Seated Height: 1.45 mm

A low profile seated height minimizes space usage on the PCB, perfect for compact or portable devices.

Width: 1.625 mm

The compact width is ideal for devices where space is a premium, ensuring a neat integration into tiny electronic designs.

Micropower: YES

The micropower rating is critical for battery-powered devices, optimizing energy consumption and extending operational life.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable reflow time ensures proper solder joint quality without risking damage to the components during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature specification confirms compatibility with standard soldering processes, enhancing manufacturability.

Length: 2.9 mm

The short length contributes to reduced space on the PCB, which is especially beneficial in miniaturized electronic designs.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade indicates the op-amp's suitability for use in automotive applications, ensuring robustness and reliability.

Low-Bias: YES

This feature is essential for precision applications, ensuring that the op-amp does not introduce significant error into the circuit.

Nominal Unity Gain Bandwidth: 790 kHz

The nominal unity gain bandwidth allows for decent frequency response, ensuring adequate performance in a wide range of applications.

Technology: CMOS

CMOS technology provides a lower power consumption profile along with high-speed performance, making it a modern choice for op-amps.

Terminal Form: GULL WING

Gull wing terminals provide good stability and reliability in solder joints, enhancing the longevity of the component.

Amplifier Type: OPERATIONAL AMPLIFIER

Classified as an operational amplifier, it is versatile for a broad range of applications including signal conditioning, filtering, and amplification.

Maximum Supply Current: 0.124 mA

This low supply current indicates efficient energy usage, making it a good choice for energy-sensitive designs.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used for its stability and ease of design, making it a common choice in analog circuits.

Packing Method: TAPE AND REEL

Tape and reel packing improves the manufacturing efficiency for automated assembly lines, facilitating mass production.

Nominal Slow Rate: 0.27 V/us

This nominal slow rate is adequate for standard applications where high-speed responses are not critical, providing reliability in design.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for compatibility with many PCB layouts, ensuring ease of manufacturing and assembly.

Technical Specifications

Operational Amplifiers (Op Amps) TSV632AILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

790 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.2 V/us

Nominal Slew Rate:

0.27 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

124 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.1

Trade Compliance

TSV632AILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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