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TSV6292ILT

STMicroelectronics

TSV6292ILT by STMicroelectronics

TSV6292ILT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 6000 µV, low bias current of 0.0001 µA, and operates within a supply range of 1.8-5 V. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,205 parts In-Stock

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6,205

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Digiode

USA . 2,957 parts In-Stock

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2,957

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ACDS - Activité Composants Distribution Service

France . 2,392 parts In-Stock

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2,392

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Bristol Electronics

USA . 2,392 parts In-Stock

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2,392

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Dan-Mar Components

USA . 2,392 parts In-Stock

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2,392

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Anansix

USA . 1,574 parts In-Stock

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1,574

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,815 parts In-Stock

1+ parts

$6.713

100+ parts

-

1k+ parts

$6.042

10k+ parts

-

1,815

$6.713

-

$6.042

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$8.205

100+ parts

$7.467

1k+ parts

$6.728

10k+ parts

-

500

$8.205

$7.467

$6.728

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MKK Technologies

India . 1,409 parts In-Stock

1+ parts

$12.624

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$12.624

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DigiPath Technology Company

USA . 1,409 parts In-Stock

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$12.624

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1,409

$12.624

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AZTECH Wire

Italy . 1,220 parts In-Stock

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$20.710

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$20.710

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Microchip USA

USA . 5,426 parts In-Stock

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Corphita

USA . 4,750 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Perfect Parts

USA . 3,279 parts In-Stock

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Vigor

Singapore . 2,936 parts In-Stock

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2,936

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 776 parts In-Stock

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$8.027

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776

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$8.027

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Overview

Unlock precision and efficiency in your designs with the TSV6292ILT from STMicroelectronics, a leading name in innovative technology. This exceptional operational amplifier combines ultra-low bias current and impressive common-mode rejection for reliable performance in automotive applications and beyond. With its compact, low-profile design, it’s perfect for space-constrained environments, delivering unmatched quality and value that empowers engineers to achieve their best work. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the Op Amp suitable for a wide range of applications.

Maximum Input Offset Voltage: 6000 uV

A low input offset voltage is crucial for precision applications, ensuring accurate signal amplification.

Maximum Average Bias Current (IIB): 0.0001 uA

This low bias current enhances the device's performance in low-power applications and preserves battery life.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact and modern circuit designs.

No. of Functions: 2

Having two functions in one package increases flexibility and can reduce component count in a design.

Package Shape: RECTANGULAR

The rectangular shape is standardized, promoting space efficiency on PCBs.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode rejection ratio helps in reducing noise, making this Op Amp ideal for sensitive applications.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage is suitable for battery-operated devices, enhancing energy efficiency.

Power Supplies (V): 1.8/5

Dual supply voltage options provide versatility in powering different circuit configurations.

No. of Terminals: 8

With 8 terminals, this Op Amp can support multiple configurations, enhancing circuit design options.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package design saves space on the PCB, facilitating compact and dense circuit layouts.

Maximum Supply Voltage Limit: 6 V

Flexible voltage limits allow for integration in various electronics without risk of damage.

Maximum Operating Temperature: 125 °C

This high operating temperature rating ensures reliability in harsh environments, making it suitable for automotive applications.

Maximum Bias Current (IIB) @25°C: 0.00001 uA

An extremely low bias current at room temperature contributes to improved performance in precision analog circuits.

Frequency Compensation: YES

Integrated frequency compensation simplifies design and enhances stability across various applications.

Minimum Voltage Gain: 4470

A high minimum voltage gain assures effective amplification of low-level signals.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance even in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish promotes solderability and enhances long-term performance in various environments.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout designs in PCB applications.

Maximum Seated Height: 1.45 mm

The compact height meets modern design requirements for low-profile electronic components.

Width: 1.625 mm

A narrow width aids in fitting multiple components onto a single PCB without requiring extensive redesigns.

Micropower: YES

Micropower operation benefits mobile and battery-powered applications by conserving energy.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates compatibility with standard soldering processes, enhancing manufacturing reliability.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures durability during assembly processes.

Length: 2.9 mm

A compact length contributes to the overall miniaturization trend in electronic designs.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive use, ensuring safety and reliability under variable environmental conditions.

Low-Bias: YES

Low-bias characteristics make this Op Amp ideal for applications demanding high precision.

Nominal Unity Gain Bandwidth: 1100 kHz

A high bandwidth allows the Op Amp to effectively handle a wide range of signal frequencies.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making it perfect for portable applications.

Terminal Form: GULL WING

Gull wing terminals ensure robust connections and ease of soldering, enhancing reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components essential for a wide array of electronic applications.

Maximum Supply Current: 0.076 mA

This low supply current allows for extensive usage in power-sensitive applications, making it energy-efficient.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture enables various configurations and wide application in signal processing.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly, enhancing production efficiency.

Nominal Slow Rate: 0.33 V/us

A controlled slow rate contributes to stability in signal processing, preventing overshoot in fast transient conditions.

Terminal Pitch: 0.65 mm

A standard terminal pitch enables compatibility with widely used PCB designs, simplifying integration.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6292ILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

4470

Nominal Slew Rate:

0.33 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.1

Trade Compliance

TSV6292ILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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