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TSV622AILT

STMicroelectronics

TSV622AILT by STMicroelectronics

TSV622AILT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 2200 µV, low bias current of 0.0001 µA, and operates within -40 °C to 125 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,996 parts In-Stock

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Digiode

USA . 3,662 parts In-Stock

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3,662

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Anansix

USA . 2,341 parts In-Stock

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2,341

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ComSIT Distribution GmbH

Germany . 188 parts In-Stock

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188

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Microchip USA

USA . 207 parts In-Stock

1+ parts

$3.238

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207

$3.238

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IDEA Electronic Components Group

UK . 806 parts In-Stock

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$6.099

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$5.489

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806

$6.099

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$5.489

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MKK Technologies

India . 452 parts In-Stock

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$11.468

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452

$11.468

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DigiPath Technology Company

USA . 452 parts In-Stock

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$11.468

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452

$11.468

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AZTECH Wire

Italy . 139 parts In-Stock

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$16.720

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$16.720

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Component Stockers USA

USA . 396 parts In-Stock

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$99.990

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396

$99.990

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Vigor

Singapore . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,059 parts In-Stock

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Corphita

USA . 4,623 parts In-Stock

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Parana Technologies

USA . 1,834 parts In-Stock

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$7.292

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$7.292

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Overview

Elevate your designs with the TSV622AILT from STMicroelectronics, a leader in innovation and quality. This cutting-edge operational amplifier delivers unmatched precision and low power consumption, making it ideal for automotive applications and beyond. With excellent common-mode rejection and minimal offset voltage, it ensures reliable performance. Trust STMicroelectronics to enhance your products with superior technology that drives efficiency and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the circuitry, making it suitable for various applications.

Maximum Input Offset Voltage: 2200 uV

A low maximum input offset voltage ensures higher accuracy in signal processing, valuable for precision applications.

Maximum Average Bias Current (IIB): 0.0001 uA

Extremely low bias current minimizes offset errors, making this op-amp ideal for low-power and sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes, making it suitable for modern electronics.

Number of Functions: 2

Having two functions increases versatility, allowing for more complex circuit designs in a single package.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCBs, facilitating high-density designs.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR ensures effective rejection of common-mode signals, enhancing the amplifier's ability to process differential signals accurately.

Nominal Supply Voltage / Vsup (V): 5

The standard supply voltage of 5V allows for compatibility with common digital logic levels, simplifying integration into existing systems.

Power Supplies (V): 1.8/5

Flexible power supply options enhance adaptability for varying applications, catering to both low-voltage and standard operational needs.

Number of Terminals: 8

The eight terminals provide adequate connections for multiple functions, optimizing circuit implementation.

Package Style (Meter): SMALL OUTLINE

The small outline packaging is ideal for space-constrained applications, enabling compact designs.

Minimum Slew Rate: 0.1 V/us

A minimum slew rate ensures the op-amp can respond quickly to input changes, making it suitable for fast signal applications.

Maximum Supply Voltage Limit: 6 V

This limit allows for safe operation under typical conditions while ensuring the op-amp remains robust against over-voltage.

Maximum Operating Temperature: 125 °C

The wide temperature range makes it suitable for automotive and industrial applications where temperature fluctuations are common.

Maximum Bias Current (IIB) @ 25 °C: 0.00001 uA

Such a low bias current enhances the precision of the signal processing function, making it suitable for high-accuracy applications.

Frequency Compensation: YES

Built-in frequency compensation simplifies circuit design and enhances stability, reducing the risk of oscillations.

Minimum Voltage Gain: 4470

A minimum voltage gain of 4470 ensures significant amplification of low-level signals, ideal for sensor and audio applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this op-amp reliable for use in harsh environmental conditions.

Terminal Position: DUAL

Dual terminal positioning enhances connection flexibility in circuit designs, allowing for easier integration.

Maximum Seated Height: 1.45 mm

The low height profile is advantageous for compact designs, reducing the overall size of electronic devices.

Width: 1.625 mm

A narrow width further assists in design compactness, making this op-amp suitable for miniaturized electronics.

Micropower: YES

Micropower operation ensures extremely low power consumption, ideal for battery-operated devices and energy-efficient applications.

Length: 2.9 mm

Short length aids in optimizing PCB space, supporting tighter layouts in advanced circuitry.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this op-amp provides reliability and performance in vehicles and other transportation applications.

Low-Bias: YES

Low-bias characteristics make this op-amp particularly effective for high-impedance signal applications, eliminating unwanted noise.

Nominal Unity Gain Bandwidth: 420 kHz

A wide bandwidth allows for a broad range of applications, ensuring effective signal processing across different frequencies.

Technology: CMOS

The use of CMOS technology offers low power consumption and high integration density, making it suitable for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy assembly and soldering, optimizing manufacturability and performance.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is versatile for various applications including filtering, signal conditioning, and amplification.

Maximum Supply Current: 0.076 mA

Very low supply current enhances battery life in portable applications, making it energy efficient.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stable performance and good bandwidth characteristics for a diverse array of applications.

Packing Method: TAPE AND REEL

Tape and reel packaging enables automated handling and placement in manufacturing processes, improving production efficiency.

Nominal Slow Rate: 0.19 V/us

A nominal slow rate provides adequate response time for many applications, benefiting designs that require moderate signal processing speed.

Terminal Pitch: 0.65 mm

A standard terminal pitch ensures compatibility with various circuit designs and assembly techniques, enhancing flexibility.

Technical Specifications

Operational Amplifiers (Op Amps) TSV622AILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

420 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

4470

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.19 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

TSSOP8,.1

Trade Compliance

TSV622AILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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