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TSV622AID

STMicroelectronics

TSV622AID by STMicroelectronics

TSV622AID from STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 2200 µV, low bias current of 0.0001 µA, and operates within -40 °C to 125 °C. This dual-function op-amp ensures high performance with a nominal gain bandwidth of 420 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,981 parts In-Stock

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8,981

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Digiode

USA . 4,185 parts In-Stock

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4,185

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Anansix

USA . 2,532 parts In-Stock

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2,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,713 parts In-Stock

1+ parts

$2.007

100+ parts

-

1k+ parts

$1.806

10k+ parts

-

1,713

$2.007

-

$1.806

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MKK Technologies

India . 2,155 parts In-Stock

1+ parts

$3.773

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-

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2,155

$3.773

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DigiPath Technology Company

USA . 2,155 parts In-Stock

1+ parts

$3.773

100+ parts

-

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2,155

$3.773

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Ampacity Inc.

Singapore . 459 parts In-Stock

1+ parts

$6.410

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459

$6.410

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AZTECH Wire

Italy . 53 parts In-Stock

1+ parts

$21.520

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53

$21.520

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Microchip USA

USA . 317 parts In-Stock

1+ parts

$24.296

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317

$24.296

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Vigor

Singapore . 2,426 parts In-Stock

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2,426

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Corphita

USA . 1,508 parts In-Stock

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1,508

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Parana Technologies

USA . 1,162 parts In-Stock

1+ parts

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$2.399

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1,162

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$2.399

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Overview

Elevate your designs with the TSV622AID operational amplifier from STMicroelectronics, a leader in semiconductor innovation. This high-performance op-amp offers exceptional precision and ultra-low power consumption, making it ideal for automotive applications and compact devices. With robust temperature resilience and industry-leading quality, the TSV622AID ensures reliability and efficiency, empowering engineers to create cutting-edge solutions that meet the demands of today's technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 2200 uV

A low maximum input offset voltage ensures improved accuracy and precision in signal amplification.

Maximum Average Bias Current (IIB): 0.0001 uA

Extremely low bias current decreases power consumption and reduces error in low-level signal applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, enhancing manufacturing efficiency.

No. of Functions: 2

Having multiple functions in one package increases flexibility in circuit design and reduces component count.

Package Shape: RECTANGULAR

Rectangular packaging simplifies layout in compact PCB designs.

Nominal Common Mode Reject Ratio: 80 dB

A high CMRR improves performance in noisy environments by rejecting common-mode signals.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V makes it compatible with standard logic levels and many power supply designs.

Power Supplies (V): 1.8/5

Wide supply voltage range allows for versatility in usage across various systems.

No. of Terminals: 8

With 8 terminals, the amplifier provides sufficient connections for various applications without excessive complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements on the PCB, enabling high-density designs.

Minimum Slew Rate: 0.1 V/us

This minimum slew rate supports moderate frequency responses, making it suitable for general-purpose applications.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage limit of 6V provides a buffer against power supply fluctuations.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product is suitable for demanding automotive and industrial applications.

Maximum Bias Current (IIB) @25°C: 0.00001 uA

An extremely low bias current at room temperature enhances precision in sensitive circuit applications.

Frequency Compensation: YES

Built-in frequency compensation ensures stability during operation across all frequencies.

Minimum Voltage Gain: 4470

A minimum voltage gain of 4470 indicates strong amplification capabilities, making it effective in amplifying weak signals.

Minimum Operating Temperature: -40 °C

Rated for low temperatures, this product is reliable in cold environments, adding to its versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

With dual terminal positioning, the amplifier allows for flexible layout options on printed circuit boards.

Maximum Seated Height: 1.75 mm

A low seated height aids in maintaining a slim profile for compact electronic designs.

Width: 3.9 mm

A compact width allows for space-efficient PCB layout, essential for modern electronics.

Micropower: YES

The micropower capability enhances battery life in portable applications, making it a great choice for low-power projects.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes for easy assembly.

Peak Reflow Temperature °C: 260

A high reflow temperature allows for reliable soldering of components during PCB assembly.

Length: 4.9 mm

A compact length offers flexibility in placement and layout, particularly in tight spaces.

Temperature Grade: AUTOMOTIVE

Automotive grade certification ensures reliability and performance in high-stress environments, suitable for automotive applications.

Low-Bias: YES

Low bias characteristics are essential for high-precision applications, ensuring minimal impact on sensitive circuits.

Nominal Unity Gain Bandwidth: 420 kHz

A bandwidth of 420 kHz is versatile enough for a wide range of signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration capability, making it an ideal choice for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable surface mount assembly and improve electrical performance.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is capable of performing a wide range of tasks including signal amplification, filtering, and mathematical operations.

Maximum Supply Current: 0.076 mA

Low supply current consumption helps extend battery life in portable applications and minimizes thermal impact in circuits.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers greater stability and bandwidth in various applications, enhancing performance.

Nominal Slow Rate: 0.19 V/us

A nominal slew rate of 0.19 V/us allows efficient handling of moderate frequency signals, making it suitable for many general tasks.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates compatibility with common PCB designs and soldering processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSV622AID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

420 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

2200 uV

Minimum Voltage Gain:

4470

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.19 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV622AID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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