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TSV6192ID

STMicroelectronics

TSV6192ID by STMicroelectronics

TSV6192ID by STMicroelectronics is a CMOS operational amplifier with low bias current and micropower features. It offers a max input offset voltage of 5000 uV, nominal unity gain bandwidth of 380 kHz, and operates at an industrial temperature grade. Ideal for applications requiring high precision amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,811 parts In-Stock

1+ parts

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2,811

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Digiode

USA . 2,170 parts In-Stock

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2,170

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Anansix

USA . 395 parts In-Stock

1+ parts

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395

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 383 parts In-Stock

1+ parts

$4.696

100+ parts

-

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383

$4.696

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$6.293

100+ parts

-

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$5.664

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1,433

$6.293

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$5.664

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MKK Technologies

India . 2,021 parts In-Stock

1+ parts

$11.833

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2,021

$11.833

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DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$11.833

100+ parts

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2,021

$11.833

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AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$13.140

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295

$13.140

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Corphita

USA . 2,237 parts In-Stock

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2,237

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

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$7.524

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868

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$7.524

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Overview

Elevate your projects with the TSV6192ID by STMicroelectronics, a top-of-the-line Operational Amplifier designed to deliver unmatched performance and reliability. Crafted by the reputable manufacturer STMicroelectronics, this cutting-edge Op Amp boasts a wide range of applications, making it a versatile choice for various projects. With its advanced features and high-quality design, the TSV6192ID offers customers exceptional value, precise results, and seamless functionality. Experience the difference with this powerful amplifier and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliable performance, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Maximum Average Bias Current (IIB): 0.000025 uA

Low bias current minimizes power consumption and helps in maintaining stable performance over time.

Surface Mount: YES

Surface mount design simplifies PCB layout and assembly, saving space and making it easier for integration into electronic devices.

No. of Functions: 2

Having 2 functions allows for versatility in circuit design and enables more complex signal processing tasks.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy mounting and placement on the circuit board, enhancing overall design flexibility.

Nominal Common Mode Reject Ratio: 71 dB

High common mode rejection ratio ensures effective rejection of noise and interference, leading to cleaner output signals.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement allows for energy-efficient operation and compatibility with low-power applications.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages offers flexibility in design and compatibility with different system requirements.

No. of Terminals: 8

Having 8 terminals enables easy connectivity and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs in electronic devices.

Maximum Supply Voltage Limit: 6 V

High supply voltage limit provides a wide operating range and ensures compatibility with various power sources.

Frequency Compensation: YES

Frequency compensation feature stabilizes the amplifier's performance over a wide range of frequencies, ensuring consistent output response.

Minimum Voltage Gain: 5000

High minimum voltage gain allows for amplification of weak signals with minimal distortion, making it suitable for precision applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for easy soldering and secure connection, enhancing overall circuit reliability.

Width: 3.9 mm

Compact width dimension saves space on the PCB and allows for more efficient layout and routing of traces.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain, accuracy, and stability, making it a versatile choice for a wide range of signal processing tasks.

Terminal Form: GULL WING

Gull-wing terminal form allows for easy surface mount soldering and reliable mechanical connection, ensuring a secure fit on the PCB.

Packing Method: TUBE

Tube packing method provides convenient storage and transportation, protecting the components from damage during handling and shipping.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6192ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

380 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

71 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

0.06 V/us

Peak Bias Current:

25 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

30 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSV6192ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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