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TSM104IDT

STMicroelectronics

TSM104IDT by STMicroelectronics

TSM104IDT from STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 6mV, low bias current of 0.2µA, and an impressive CMRR of 85dB. Ideal for industrial applications, it operates within -40 °C to 105 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,862 parts In-Stock

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5,862

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Digiode

USA . 4,468 parts In-Stock

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4,468

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Cyclops Electronics Ltd

UK . 3,270 parts In-Stock

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3,270

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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Anansix

USA . 1,809 parts In-Stock

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1,809

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ACDS - Activité Composants Distribution Service

France . 463 parts In-Stock

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463

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Bristol Electronics

USA . 463 parts In-Stock

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463

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Dan-Mar Components

USA . 463 parts In-Stock

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463

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LittleDiode

UK . 1 parts In-Stock

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1

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

$2.522

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266

$2.802

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$2.522

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MKK Technologies

India . 819 parts In-Stock

1+ parts

$5.270

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819

$5.270

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DigiPath Technology Company

USA . 819 parts In-Stock

1+ parts

$5.270

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819

$5.270

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AZTECH Wire

Italy . 834 parts In-Stock

1+ parts

$15.420

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834

$15.420

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QUARKTWIN TECHNOLOGY LTD

USA . 24,518 parts In-Stock

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24,518

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Kepictronics

USA . 15,500 parts In-Stock

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15,500

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Perfect Parts

USA . 8,917 parts In-Stock

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Microchip USA

USA . 7,852 parts In-Stock

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Assy Fe

Spain . 7,800 parts In-Stock

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 6,551 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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Corphita

USA . 3,909 parts In-Stock

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Authorized Procurement Solutions

USA . 3,395 parts In-Stock

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3,395

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GreenTree Electronics

Israel . 2,962 parts In-Stock

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2,962

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Parana Technologies

USA . 864 parts In-Stock

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$3.351

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864

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$3.351

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Overview

Elevate your designs with the TSM104IDT from STMicroelectronics, a leader in cutting-edge semiconductor technology. Engineered for exceptional performance, this operational amplifier offers incredible precision and low power consumption, making it ideal for industrial applications, signal conditioning, and sensor interfacing. With robust temperature tolerance and minimal bias currents, it delivers reliability you can count on—enhancing the quality of your projects while maximizing value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and resilience in various operating conditions.

Maximum Input Offset Voltage: 6000 uV

A low input offset voltage enhances the accuracy and stability of signal amplification, making this op-amp suitable for precision applications.

Maximum Average Bias Current (IIB): 0.2 uA

The low bias current minimizes errors in circuits, particularly in high-impedance applications, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact circuitry, facilitating easier integration into modern electronic devices.

No. of Functions: 4

Having multiple functions in a single package increases versatility, reducing component count and saving PCB space.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout flexibility and space utilization on printed circuit boards (PCBs).

Nominal Common Mode Reject Ratio: 85 dB

A high common mode reject ratio improves signal integrity by reducing interference from common noise sources.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is ideal for most low-power applications, ensuring compatibility with a wide range of systems.

Power Supplies (V): 5

Operating on a 5V supply allows for cost-effective power management and simplicity in design.

No. of Terminals: 16

The 16-terminal configuration provides ample connectivity options for various applications, facilitating diverse circuit designs.

Package Style (Meter): SMALL OUTLINE

A small outline package style permits a compact design, making it suitable for space-constrained applications.

Minimum Slew Rate: 0.1 V/us

A minimum slew rate allows for moderate signal responsiveness, suitable for many general-purpose applications.

Maximum Supply Voltage Limit: 36 V

The high maximum supply voltage offers flexibility in high-voltage applications, enhancing the op-amp's versatility.

Maximum Operating Temperature: 105 °C

With a high operational temperature range, this op-amp is well-suited for industrial and high-temperature applications.

Maximum Bias Current (IIB) @25 °C: 0.15 uA

This very low bias current further minimizes offset errors, making it an excellent choice for high-accuracy circuits.

Frequency Compensation: YES

Built-in frequency compensation simplifies circuit design, ensuring stable operation across a range of frequencies.

Minimum Voltage Gain: 25000

A high minimum voltage gain is ideal for applications requiring significant amplification, enhancing signal processing capabilities.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable performance in harsh environments, making it suitable for industrial use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The durable terminal finish enhances solderability and resistance to corrosion, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layouts, enabling efficient circuit designs.

Maximum Seated Height: 1.75 mm

A low seated height enables compact designs and better thermal management in dense electronic assemblies.

Width: 3.9 mm

Narrow width enhances layout flexibility, allowing for more compact PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

Compliance with reflow standards ensures compatibility with automatic assembly processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability indicates robustness in thermal management, suitable for modern soldering techniques.

Length: 9.9 mm

Short length contributes to the compactness, allowing for high-density packaging in circuit boards.

Temperature Grade: INDUSTRIAL

Classified for industrial temperature ranges, this product is reliable for demanding environments and applications.

Nominal Unity Gain Bandwidth: 900 kHz

A high unity gain bandwidth supports a wide range of applications, including high-speed signal processing.

Technology: BIPOLAR

Bipolar technology offers good performance in terms of speed and bandwidth, making it suitable for various applications.

Terminal Form: GULL WING

Gull wing terminals are preferred for surface-mount applications, providing excellent mechanical stability and soldering characteristics.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile for various analog signal processing tasks.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used for its simplicity and effectiveness in many linear applications.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates efficient automated handling, promoting faster assembling in production lines.

Nominal Slow Rate: 0.3 V/us

While slower than some alternatives, this rate is still sufficient for many general applications, optimizing power consumption.

Terminal Pitch: 1.27 mm

A standard terminal pitch is compatible with various PCB layouts, simplifying design iterations and assembly.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this component is suitable for standard soldering processes, ensuring reliable performance in humid environments.

Technical Specifications

Operational Amplifiers (Op Amps) TSM104IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

900 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.3 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

150 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.39 in (9.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.25

Trade Compliance

TSM104IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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